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FA1 NCRP RF Microwave PCB Multilayer Rogers 4003C ENIG

FA1 NCRP RF Microwave PCB Multilayer Rogers 4003C ENIG

  • Vurgulamak

    NCRP rf printed circuit board

    ,

    Multilayer rf printed circuit board

    ,

    NCRP fast turn pcb assembly

  • Product attributes
    microwave pcb,rf pcb,rogers pcb,Immersion gold(ENIG)
  • Copper Thickness
    0.5-3 oz
  • Tolerance
    +/-10%
  • Impedance Control
    50Ω, 75Ω
  • Solder Mask Color
    Green, Blue, Black, Red, Yellow, White
  • Maximum Panel Size
    600x1200 mm
  • Silkscreen Color
    White, Black, Yellow
  • Lead Time
    3-5 days for prototype, 7-10 days for mass production
  • Place of Origin
    Shenzhen,China
  • Marka adı
    ONESEINE
  • Sertifika
    ISO9001,ISO14001
  • Model Number
    ONE-102
  • Minimum Order Quantity
    1pcs
  • Fiyat
    USD0.1-1000
  • Packaging Details
    Vacuun bag
  • Delivery Time
    5-8 working days
  • Payment Terms
    T/T, Western Union
  • Supply Ability
    1000000000pcs/mon

FA1 NCRP RF Microwave PCB Multilayer Rogers 4003C ENIG

FA1 NCRP RF Printed Circuit Board Fast Turn PCB Assembly Multilayer
Product Specifications
Attribute Value
Product Type Microwave PCB, RF PCB, Rogers PCB
Surface Finish Immersion Gold (ENIG)
Copper Thickness 0.5-3 oz
Tolerance ±10%
Impedance Control 50Ω, 75Ω
Solder Mask Color Green, Blue, Black, Red, Yellow, White
Maximum Panel Size 600×1200 mm
Silkscreen Color White, Black, Yellow
Lead Time 3-5 days (prototype), 7-10 days (mass production)
Product Details
FA1 NCRP PCB 8 Multilayer RF Printed Circuit Board Design Manufacture
Quick Specifications
  • Material: Rogers 4003C
  • PCB Size: 2×2CM
  • Layers: 2
  • Surface Finish: ENIG
  • Copper Weight: 1OZ
  • RF PCB samples available
Premium Materials for RF/Microwave PCBs
We support a wide range of high-performance materials including Rogers (RO4003C, RO4350B, RO4360 series), Taconic (TLY-5A, TLY-5, TLY-3 series), Arlon (AD255, AD300 series), and specialized F4BK/F4BM series from Wangling/Taixing.
Microwave PCB Overview
Microwave PCBs are specialized circuit boards engineered for high-frequency applications (300MHz to several GHz). These boards feature:
  • Optimized high-frequency signal handling
  • Low-loss dielectric materials (PTFE, ceramic-filled substrates)
  • Precision impedance control (50Ω/75Ω standard)
  • Advanced RF connector integration (SMA, SMP)
  • Comprehensive EMI shielding solutions
These boards are essential for microwave communication systems, radar technology, satellite communications, and high-frequency test equipment.
Critical Design Considerations
Successful RF PCB manufacturing requires strict adherence to:
  • Signal integrity preservation
  • Crosstalk minimization
  • Component reliability assurance
  • Precision impedance matching
  • Advanced thermal management
FA1 NCRP RF Microwave PCB Multilayer Rogers 4003C ENIG 0