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Vurgulamak
0.6mm mcpcb led board
,2 Layer mcpcb led board
,custom mcpcb Circuit Board
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Katman sayısı2
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MalzemeAlüminyum
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KökenÇin
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TipPCB panosu
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Board_thickness0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm
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Bitmiş kalınlık1.0mm
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Yüzey tedavisiHasl Kurşun Ücretsiz
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Yüzey BittiDaldırma altın. OSP.HAL
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Place of OriginShenzhen,China
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Marka adıONESEINE
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SertifikaISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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FiyatUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T,Western Union
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Supply Ability1000000000pcs/mon
2 Layer Aluminum Core PCB Board 1.6mm with Copper Foil
Custom Copper Core MCPCB LED Board 0.4mm 0.6mm 2 Layer Circuit Board
Product Specifications
| Attribute | Value |
|---|---|
| Layer Count | 2 |
| Material | Aluminum |
| Origin | China |
| Type | PCB Board |
| Board Thickness | 0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm |
| Finished Thickness | 1.0mm |
| Surface Treatment | HASL Lead Free |
| Surface Finished | Immersion gold, OSP, HAL |
Product Description
China Factory 2 Layer Aluminum Base Copper Core PCB Board
PCB Parameters
- Board thickness: 1.6MM
- Brand: Oneseine
- Withstand voltage: AC2000V
- Thermal conductivity: 2.0w/m.k
- Copper foil thickness: 1OZ
- Quality certification: ULE354470/ISO/SGS/IATF16949
- Surface treatment: OSP
- Test: 100% computer open and short circuit test
Advanced Metal Core PCB Technology
Our metal core PCBs feature cutting-edge substrate innovations including anodized aluminum alloys (6061-T6) for thermal management and Direct Bonded Copper (DBC) substrates for extreme power density applications. The technology incorporates:
- Plasma Electrolytic Oxidation (PEO) for enhanced dielectric strength
- Magnetic Pulse Clamping for void-free lamination
- Electrophoretic Dielectric Deposition for pinhole-free insulation
- Conformal Cooling Channels for active thermal management
Reliability & Performance
Our PCBs undergo rigorous testing protocols including 2000hrs @ 150°C junction temperature testing per AEC-Q102 standards. Performance benchmarks show:
- AlN ceramic cores sustain 35kV/mm field strength at 200°C
- Cu-Mo-Cu sandwiches reduce thermal impedance by 62%
- Nanodiamond-filled dielectrics achieve k=12 W/mK
- Hybrid Al/grafcore laminates enable 500W/in² dissipation
Certifications
Compliant with MIL-PRF-32535M, ISO 1817, IPC-7093B, and JEDEC JESD51-14 standards for military, automotive, and industrial applications.
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