Metal Core OSP 94V0 LED Light MCPCB
High-performance PCB for electronics with ROHS compliance
Product Specifications
Attribute |
Value |
Surface Finish |
HASL |
Dielectric Constant |
4.0 |
Thickness |
0.8mm |
UL Certification |
94V-0 |
Application |
LED Lighting |
Thermal Conductivity |
1.5W/mK |
Material |
Metal Core |
Layer Count |
Single Layer |
Rohs Compliant |
Yes |
Silkscreen Color |
Black |
Solder Mask Color |
White |
Min Operating Temperature |
-40°C |
Max Operating Temperature |
130°C |
Copper Thickness |
1oz |
Customized Copper Core Metal Core PCB
Designed for high-power electronics applications
Key Parameters
- Brand: Oneseine
- Application: Full range of fluorescent lamps
- Maximum size: 1500mm
- Substrate material: Aluminum
- Thickness range: 0.6-2.0mm
- Copper foil thickness: 18-70μm
- Surface treatment: OSP/HAL/HASL (Lead free)
- Thermal conductivity: 1.0 - 3.0W/m.k
- Breakdown voltage: 1.0-3.0KV(AC)
- Flammability: 94V0
- Standards: UL & ROHS compliant
Manufacturing Process
Stage 1: Base Preparation
- Material: 5052/6061 Al or C1100 Cu
- Surface Treatment: Alkaline wash → Anodization (Al) / Antioxidant coating (Cu)
- Flatness Tolerance: ≤0.1mm/m²
Stage 2: Dielectric Lamination
- Standard Materials: Bergquist HT-04503 (100μm), Laird Tputty506 (150μm)
- Thermal Resistance: <0.3°C-in²/W
- Breakdown Voltage: >3kV AC
Stage 3: Circuit Fabrication
- Copper Weight Options: 1oz (35μm) to 10oz (350μm)
- Etching Precision: ±10% line width tolerance
- Min. Trace/Space: 0.15mm/0.15mm (LDI process)
Stage 4: Thermal Management Features
- Via Fill: Conductive epoxy (0.8-1.5 W/mK)
- Plated Through Holes: Aspect ratio 8:1 max
- Edge Plating: 360° coverage for chassis grounding
Quality Validation Protocol
Thermal Cycling
- Condition: -55°C ↔ +150°C, 500 cycles (IPC-TM-650 2.6.7)
- Acceptance: No delamination, <5% resistance change
Thermal Resistance Test
- Method: ASTM D5470
- Standard: θja <1.5°C/W (for 1.0mm Al core)
High-Potential Test
- Voltage: 3kV AC, 60s (UL 796)
- Leakage: <5mA