Fluorescent Lamp Aluminum Bare MCPCB Board Imm Tin For LED Lighting
Product Specifications
Attribute |
Value |
Material |
Aluminum |
Layers |
1 |
Metal Core |
Yes |
Manufacturer |
pcb manufacture |
Surface Treatment |
ENIG, OSP, HASL, Imm Tin, Imm Silver... |
Conductor Width |
8 mil |
Product Type |
Printed Circuit Board |
Thermal Conductivity |
1.0 - 8.0 W/mK |
PCB Parameters
- Brand: Oneseine
- Application: Full range of fluorescent lamps
- Maximum size: 1500mm
- Substrate material: Aluminum
- Thickness: 0.6-2.0mm
- Copper foil thickness: 18-70um
- Surface treatment: OSP/HAL/HASL (Lead free)
- Thermal conductivity: 1.0 - 3.0W/m.k
- Breakdown voltage: 1.0-3.0KV(AC)
- Flammability: 94V0
- Standard: UL & ROHS
Metal Core PCB Variants & Manufacturing Specifications
Material Classification:
Metal core PCBs utilize specialized substrates for thermal management:
- Aluminum Core (80% market share)
Applications: LED lighting, automotive electronics, power supplies
Advantages: Cost efficiency (¥120-300/m²), thermal conductivity 1-3 W/mK, lightweight (2.7g/cm³)
- Copper Core
Applications: RF/microwave systems, high-power converters
Performance: Superior thermal transfer (400 W/mK), 3× aluminum cost, weight penalty (8.96g/cm³)
- Iron Alloy Core
Applications: Motor controllers, EMC-sensitive systems
Characteristics: Magnetic permeability >10k μ, thermal conductivity 80 W/mK
- Composite Core
Architecture: Aluminum-copper hybrids (e.g., 1.5mm Al + 0.3mm Cu)
Benefit: Balanced thermal-mechanical performance (CTE 14 ppm/°C)
- Ceramic Core
Substrates: Al₂O₃ (24-28 W/mK), AlN (170-230 W/mK)
Use Cases: Aerospace power modules, laser diodes
- Flexible Metal Core
Construction: Polyimide-on-aluminum (bend radius >5mm)
Applications: Curved displays, wearable medical devices
Production Process
Advanced thermal management PCBs require 18 specialized stages:
- Design Phase
Thermal simulation (ANSYS Icepak)
CTE-matching component placement
- Base Preparation
Metal core CNC milling (±0.05mm tolerance)
Alkaline degreasing + anodization (Al cores)
- Dielectric Lamination
Thermally conductive polymers (e.g., Bergquist HT-04503, 100μm±5μm)
Bonding strength >8N/mm² after 260°C reflow
- Circuit Formation
Laser Direct Imaging (25μm feature resolution)
Acidic copper etching (1oz-10oz thickness)
- Drilling & Metallization
Laser/mechanical drilling (0.2-6.0mm holes)
Void-free via filling (conductive epoxies)
- Surface Finishing
Ni/Au (ENIG): 3-5μm Ni + 0.05-0.1μm Au
Immersion Sn/Ag: Low-cost alternatives
- Validation
Thermal cycling (-55°C↔150°C, 500 cycles)
IST testing (1000+ hours @ 150°C)