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Aluminum MCPCB Board for LED Lighting with Imm Tin Finish

Aluminum MCPCB Board for LED Lighting with Imm Tin Finish

  • Vurgulamak

    Fluorescent Lamp Mcpcb Board

    ,

    LED lighting Mcpcb Board

    ,

    Aluminum bare mcpcb

  • Malzeme
    Alüminyum
  • Katmanlar
    1
  • Metal çekirdeği
    Evet
  • Üretici
    PCB üretimi
  • Yüzey tedavisi
    Enig, OSP, Hasl, Imm Tin, Imm Silver ...
  • İletken genişliği
    8 Mil
  • Ürün türü
    Basılı devre kartı
  • Termal iletkenlik
    1.0 - 8.0 w/mk
  • Place of Origin
    Shenzhen,China
  • Marka adı
    ONESEINE
  • Sertifika
    ISO9001,ISO14001
  • Model Number
    ONE-102
  • Minimum Order Quantity
    1pcs
  • Fiyat
    USD0.1-1000
  • Packaging Details
    Vacuun bag
  • Delivery Time
    5-8 working days
  • Payment Terms
    T/T,Western Union
  • Supply Ability
    1000000000pcs/mon

Aluminum MCPCB Board for LED Lighting with Imm Tin Finish

Fluorescent Lamp Aluminum Bare MCPCB Board Imm Tin For LED Lighting
Product Specifications
Attribute Value
Material Aluminum
Layers 1
Metal Core Yes
Manufacturer pcb manufacture
Surface Treatment ENIG, OSP, HASL, Imm Tin, Imm Silver...
Conductor Width 8 mil
Product Type Printed Circuit Board
Thermal Conductivity 1.0 - 8.0 W/mK
PCB Parameters
  • Brand: Oneseine
  • Application: Full range of fluorescent lamps
  • Maximum size: 1500mm
  • Substrate material: Aluminum
  • Thickness: 0.6-2.0mm
  • Copper foil thickness: 18-70um
  • Surface treatment: OSP/HAL/HASL (Lead free)
  • Thermal conductivity: 1.0 - 3.0W/m.k
  • Breakdown voltage: 1.0-3.0KV(AC)
  • Flammability: 94V0
  • Standard: UL & ROHS
Metal Core PCB Variants & Manufacturing Specifications
Material Classification:
Metal core PCBs utilize specialized substrates for thermal management:
  • Aluminum Core (80% market share)
    Applications: LED lighting, automotive electronics, power supplies
    Advantages: Cost efficiency (¥120-300/m²), thermal conductivity 1-3 W/mK, lightweight (2.7g/cm³)
  • Copper Core
    Applications: RF/microwave systems, high-power converters
    Performance: Superior thermal transfer (400 W/mK), 3× aluminum cost, weight penalty (8.96g/cm³)
  • Iron Alloy Core
    Applications: Motor controllers, EMC-sensitive systems
    Characteristics: Magnetic permeability >10k μ, thermal conductivity 80 W/mK
  • Composite Core
    Architecture: Aluminum-copper hybrids (e.g., 1.5mm Al + 0.3mm Cu)
    Benefit: Balanced thermal-mechanical performance (CTE 14 ppm/°C)
  • Ceramic Core
    Substrates: Al₂O₃ (24-28 W/mK), AlN (170-230 W/mK)
    Use Cases: Aerospace power modules, laser diodes
  • Flexible Metal Core
    Construction: Polyimide-on-aluminum (bend radius >5mm)
    Applications: Curved displays, wearable medical devices
Production Process
Advanced thermal management PCBs require 18 specialized stages:
  • Design Phase
    Thermal simulation (ANSYS Icepak)
    CTE-matching component placement
  • Base Preparation
    Metal core CNC milling (±0.05mm tolerance)
    Alkaline degreasing + anodization (Al cores)
  • Dielectric Lamination
    Thermally conductive polymers (e.g., Bergquist HT-04503, 100μm±5μm)
    Bonding strength >8N/mm² after 260°C reflow
  • Circuit Formation
    Laser Direct Imaging (25μm feature resolution)
    Acidic copper etching (1oz-10oz thickness)
  • Drilling & Metallization
    Laser/mechanical drilling (0.2-6.0mm holes)
    Void-free via filling (conductive epoxies)
  • Surface Finishing
    Ni/Au (ENIG): 3-5μm Ni + 0.05-0.1μm Au
    Immersion Sn/Ag: Low-cost alternatives
  • Validation
    Thermal cycling (-55°C↔150°C, 500 cycles)
    IST testing (1000+ hours @ 150°C)
Aluminum MCPCB Board for LED Lighting with Imm Tin Finish 0