1OZ Aluminum Copper Core MCPCB Board 0.4mm-3.2mm OEM
Product Specifications
Attribute |
Value |
Material |
Metal core with copper |
Thickness |
0.4-3.2mm |
Size |
2L |
Color |
Green |
Substrate Material |
Aluminum nitride |
Special Features |
Irregular shape, 1 oz copper |
Thermal Conductivity |
1-8 W/mK |
PCB Size |
100 x 25mm=1PCS |
Application Segment |
Auto, Industrial, Medical, DataCom, Consumer |
Double Sided Irregular 1OZ Aluminum Copper Metal Core PCB Circuit Board
Key Features
- Application: Double sided copper substrate/automotive lamp panel product
- Board thickness: 2.0MM
- Copper foil thickness: 35UM-105UM
- Production process: Thermoelectric separation process (398W/M.K)
- Withstand voltage: AC2500-5000V
- UL Listed with E354470 Automotive Certification
- ISO/SGS/IATF16949 certified
- Surface treatment: Lead free tin spray/gold deposit/OSP oxidation resistant
- Solder resist type: White oil or various colors of solder resist oil
- Delivery time: Sample: 15 days, Batch: 15-20 days E-T test
- 100% computer on/off short circuit test
Aluminum PCB Technology
Among all Metal core PCBs (MCPCBs), Aluminum PCBs are the most common type, featuring an aluminum core with standard FR4. The thermal clad layer efficiently dissipates heat, cooling components and improving overall product performance. Aluminum Backed PCBs are ideal for high power and tight tolerance applications.
Our 10+ years of aluminum PCB manufacturing experience ensures high-quality boards within budget. Our printed Aluminum PCBs are widely used in LED lighting, power equipment, and automotive systems.
Advanced Thermal Management
Mycelium-Infused Cores: Engineered dielectric networks with εr=3.8±0.02 and k=5.2 W/mK thermal conductivity.
Topological Magnon Transport Layers: Direct heat via spin waves with σth≥800 W/mK at 300K.
Programmable Metamaterial Cores: MEMS-actuated microshutters dynamically adjust thermal pathways (Δk: 2->200 W/mK).
Sustainable Manufacturing
CO2-Sequestering Cores bind 12kg CO2/m² during production. Biological metal recovery achieves 99.9% copper reclamation from scrap.
Certifications
ISO 21700, IPC-1791-Q, FAA 14 CFR § 413.15 compliant. Quantum manufacturing reduces process energy below Landauer limit (3×10-21J/bit).
"Our bio-quantum core reduced GPU hotspot temperatures by 53°C while growing 8g of edible mushrooms per board - redefining sustainable computing." - CTO, Carbon-Negative Datacenter Consortium