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Vurgulamak
TG170 smd pcb assembly
,Green Solder smd pcb assembly
,TG170 embedded pcb
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ürünYüksek termal PCB
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malzemeFr4
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Tg180
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termal iletkenlikYüksek
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Lehim maske rengiYeşil, kırmızı, mavi, siyah, beyaz
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RenkYeşil lehim maskesi
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Temel malzemeFR-4
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Yüzey kaplamasıIvır zıvır
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Place of OriginShenzhen,China
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Marka adıONESEINE
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SertifikaISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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FiyatUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T, Western Union
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Supply Ability1000000000pcs/mon
High TG180 FR4 PCB with ENIG Finish for Industrial Applications
Embedded High TG170 SMD PCB Assembly Circuit Board with Green Solder Mask
| Attribute | Value |
|---|---|
| Product Type | High thermal PCB |
| Material | FR-4 |
| TG Rating | 180 |
| Thermal Conductivity | High |
| Solder Mask Colors | Green, Red, Blue, Black, White |
| Base Material | FR-4 |
| Surface Finishing | ENIG |
High Thermal Conductivity FR-4 High TG 170/180 PCB Circuit Board
Specifications: 2-layer construction, 1.0mm thickness, 35μm copper, ENIG surface finish, customizable board size with 3mil minimum line width and 0.15mm minimum hole diameter.
FR-4 High TG PCB Concept
370HR is a high-performance 180°C glass transition temperature (Tg) FR-4 system designed for multilayer printed wiring board applications requiring maximum thermal performance and reliability. This system provides improved thermal performance and low expansion rates compared to traditional FR-4 while maintaining excellent processability.
Key Points: The glass transition temperature (Tg) indicates when a PCB changes from rigid to flexible state. For environments exceeding 130-140°C, high Tg materials (>170°C) are essential. The Tg value should be 10-20°C higher than the product's maximum operating temperature.
High TG PCB Material Properties
High Tg materials maintain dimensional stability and performance at elevated temperatures. Compared to standard FR-4, high Tg boards offer:
- Enhanced heat resistance (170°C+ vs 130°C standard)
- Improved mechanical strength at high temperatures
- Better moisture and chemical resistance
- Superior stability in lead-free HAS processes
Applications
Ideal for demanding environments including:
- Petrochemical and mining industries
- Industrial equipment and automotive electronics
- Medical devices and aerospace systems
- Power converters and high-brightness LED circuits
- Military and satellite applications
Key Features
- Excellent heat dissipation (3-4 times better than standard FR-4)
- Superior thermal and insulation reliability
- Enhanced processability with low Z-CTE
- Maintains mechanical integrity at high temperatures
- Improved dimensional stability
Technical Overview
High TG PCBs use specialized laminates with thermally stable resin systems that exhibit better thermal stability, lower coefficient of thermal expansion (CTE), and improved mechanical strength compared to standard PCB materials. The manufacturing process includes controlled heating/cooling profiles and enhanced copper plating techniques to ensure reliability in high-temperature environments.
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