HDI PCB High TG 180 Multilayer Circuit Board 0.5-3.2mm

Board Thickness: 0.4mm-8.5mm
Min. Hole Size: 0.2mm
Min. Line Width: 0.1mm
Min. Line Spacing: 0.1mm
Surface Finishing: HASL, HAL-LF, OSP ENIG etc
Min inner Layer Clearance: 0.1mm
PCBA business: OEM&ODM service
Multi-layer: 1-22 layers for your choose
Silkscreen color: white black red yellow
Solder mask color: green, red, black, blue, white, etc
Warp and Twist: ≤0.7%
Place of Origin: Guangdong, China (Mainland)
Brand Name: ONESEINE PCB
Base Material: Isola FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum
Copper Thickness: 1-6OZ

Tg means Glass Transition Temperature. As flammability of board is V-0 (UL 94-V0), if the temperature exceeds designated Tg value, the board will change from glassy state to rubbery state, affecting its functionality.

Different countries and companies prefer different high-Tg materials. We typically use S1170 from SYL unless otherwise specified. 170Tg is popular in LED industry due to better heat dissipation and cost-effectiveness compared to MCPCB.

High Tg materials feature:

High Tg refers to high heat resistance. Generally, Tg ≥ 170℃ PCBs are called high Tg printed circuit boards. With electronics advancing toward higher functionality and multi-layer designs, substrate materials require greater heat resistance.

High Tg PCBs offer improved heat resistance, moisture resistance, chemical resistance, and stability compared to standard FR-4. The higher the Tg value, the better the temperature resistance, especially in lead-free processes.

High TG PCBs are designed to withstand elevated temperatures (150°C to 180°C or higher) without significant dimensional changes or loss of mechanical integrity. They use specialized laminates with thermally stable resin systems, offering better thermal stability, lower CTE, and improved mechanical strength.

Manufacturing involves controlled heating/cooling profiles, improved copper plating techniques, and specialized solder mask materials to ensure reliability in high-temperature environments.