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Vurgulamak
Glass Epoxy High TG PCB
,Prototype High TG PCB
,Prototype glass epoxy fr4 pcb
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Ürün adıAltın Parmak Çok Katmanlı FR4 PCB
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TgYüksek TG (150-160)
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Minimum delik boyutu0.15 mm
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SMD sahası0,3 mm
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Yüzey kaplamasıHasl, Enig, OSP, daldırma gümüş, daldırma tenekesi
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RenkYeşil
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CU kalınlığı1 oz
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Yüzey kaplama teknolojisiÖZELLEŞTİRMEK
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Place of OriginShenzhen,China
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Marka adıONESEINE
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SertifikaISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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FiyatUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T,Western Union
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Supply Ability1000000000pcs/mon
High TG FR4 Multilayer PCB with Gold Finger 0.15mm Hole
Gold Finger Multilayer Glass Epoxy FR4 High TG PCB Printed Circuit Board Prototype
Product Specifications
| Attribute | Value |
|---|---|
| Product name | Gold Finger Multilayer Fr4 PCB |
| TG | High TG (150-160) |
| Minimum hole size | 0.15mm |
| SMD Pitch | 0.3mm |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin |
| Color | Green |
| Cu Thickness | 1OZ |
| Surface Finish Technology | CUSTOMIZE |
Quick Details
| Material | FR4 | Min line | 3/3 |
| Layer | 6 | Min hole | 0.15mm |
| Surface finish | HASL lf | Stack up file | yes |
| Copper | 2OZ | Blind hole | yes |
| Thickness | 1.25MM | Quantity | prototype |
High TG PCB Technology
High Tg PCBs (printed circuit boards) are increasingly demanded in modern electronics manufacturing. The Glass Transition Temperature (Tg) is critical for boards exposed to high thermal loads, as exceeding this value affects circuit functionality.
Key Characteristics of High Tg PCBs
- Standard Tg for copper clad laminate is 130-140℃, while High Tg exceeds 170℃
- Enhanced performance in mechanical strength, dimensional stability, and moisture resistance
- Essential for lead-free PCB manufacturing processes
- Superior performance in high-density, multilayer applications
- Better thermal decomposition resistance compared to standard FR4
FR4 Material Variants
- Standard FR4: Most common type with heat resistance of 140-150℃
- High Tg FR4: For applications requiring temperatures above 150℃
- High CTI FR4: Improved thermal conductivity with CTI above 600V
- Non-Copper FR4: Excellent mechanical strength for insulating boards
- FR4 G10: Solid core material with superior thermal shock resistance
High Frequency PCB Requirements
- Stable dielectric constant (Dk)
- Minimal dielectric loss (Df) for signal integrity
- Thermal expansion coefficient matching copper foil
- Low water absorption to maintain performance
- Excellent heat and chemical resistance
FR4 PCB Material Overview
FR-4 is a flame-retardant, glass-reinforced epoxy laminate material standardized by NEMA. The woven glass-reinforced epoxy resin construction provides high strength and electrical insulation properties, making it ideal for single-sided, double-sided, and multilayer PCBs.
Product Description
Engineered for extreme environments, our High-Tg FR4 Multilayer PCBs feature military-grade hard gold fingers (30μ" min.) and support up to 24 layers for complex industrial systems. These prototypes deliver unmatched durability for edge-card connectors, server backplanes, and mission-critical control systems where reliability is non-negotiable.
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