Attribute | Value |
---|---|
Dielectric Constant | 4.5-5.4 |
Min Holes Size | 4mil |
Size | 60mm × 230mm |
Min. Line Width/Spacing | 3mil/3mil |
Board Thickness | 1.2 mm |
Special Process | Disc hole + High Tg mixed pressure |
Shipping Way | By Air, DHL / FedEx / UPS / TNT |
Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin |
Base Material | FR-4 S1000-2M |
Copper Weight | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Model | ONESEINE |
---|---|
Minimum line spacing | 0.35mm |
Minimum line width | 0.35mm |
Material | Shengyi S7136 fr4 TG170 |
Solder mask color | Green, White, Black or customized |
Type | CEM - Electronic manufacturing, assembly and fabrication |
Board shape | Customized |
Size | 180 × 320mm |
Number of layers | 8 layer |
Application | Postal and Telecommunication, Consumer Services, Electrical Energy, Medical Equipment, Automotive, Household Appliance |
Packing | Vacuum package with seaworthy carton box |
Gold fingers are the connection points between memory modules and memory slots, serving as signal transmission channels. These gold-plated conductive contacts are arranged like fingers, hence the name. The gold plating provides superior oxidation resistance and conductivity, though tin plating is now commonly used for cost efficiency.
Gold fingers (or edge connectors) are inserted into connector card slots, creating external connections for the PCB. The gold plating ensures reliable conductivity and durability, though high-performance applications may still use gold plating for superior performance.
High TG PCBs (glass transition temperature above 150°C) are engineered for elevated temperature environments. These specialized boards maintain structural integrity at higher temperatures than standard PCBs (130-140°C), making them ideal for power electronics, automotive, aerospace, and industrial applications.
Manufactured with thermally stable materials like advanced FR-4 or polyimide, high TG PCBs feature improved thermal stability, reduced thermal expansion, and enhanced mechanical strength. Specialized manufacturing processes ensure reliable performance under thermal stress.