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Vurgulamak
HDI High TG PCB
,Goldfinger High TG PCB
,Multilayer pcb goldfinger
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Katman sayısı8
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Adım sayımı1
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Sona ermekAltın parmak
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Kalınlık32U
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TeknolojiHDI
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Ürün türüPCB
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Place of OriginShenzhen,China
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Marka adıONESEINE
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SertifikaISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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FiyatUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T,Western Union
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Supply Ability1000000000pcs/mon
8 Layer HDI PCB 32u Gold Finger High TG180 Multilayer
32u HDI Multilayer High TG180 PCB Fabrication Goldfinger 8 Layers
Product Specifications
| Attribute | Value |
|---|---|
| Layer Count | 8 |
| Step Count | 1 |
| Finish | Gold Finger |
| Thickness | 32u |
| Technology | HDI |
| Product Type | PCB |
PCB Parameters
- Plate used: FR-4
- Number of layers: 8
- Board thickness: 1.0+/-0.1mm
- Surface treatment: Immersion gold, OSP, electric gold finger 32u
- Application area: memory board
- Features: Drilling 1-3 4-5 6-8
High-Performance 8-Layer HDI PCBs
Our 32μm HDI multilayer PCBs with 1-step gold fingers are engineered for mission-critical applications in aerospace, medical, and defense systems where conventional PCBs fail.
Key Advantages:
- 50μ" Hard Gold plating (5× industry thickness)
- Laser-drilled 32μm microvias with 1:1.2 aspect ratio
- ±3% impedance control @ 40GHz
- Tg180 FR4/High-Speed Hybrid stackups
Gold Finger Technology
- 1-Step Electrolytic Plating with 50μ" gold hardness >200HK
- 300K mating cycles @ 50N force (MIL-G-45204 compliant)
- Precision laser-cut bevels: 30°±0.5° with Ra<0.1μm
- 360° wrap-around plating prevents edge cracking
32μm HDI Breakthroughs
- Microvia-in-Pad supports 0.15mm pitch BGA
- Stacked microvias with 8:1 aspect ratio for 16Gb/s signals
- 100% void-free copper via fill (X-ray verified)
Signal Integrity Features
- Hybrid Dk Control: εr=3.48±0.02 (1-40GHz)
- Near-Zero Loss: <0.002dB/mm @ 110GHz
- EMI Shielding: -55dB crosstalk via hatched grounds
Certified Applications
Surgical Robotics
- 0.008mm² misregistration
- ISO 13485 compliant
- 1,000 autoclave cycle rating
Satellite RF Switches
- Ka-band beamforming
- PIM <-168dBc @ 2x43dBm
- NASA-STD-8739.4 certified
Industrial Backplanes
- 250K hot-swap cycles
- 25Gbps ARINC 818 compatible
- UL 94V-0 + IP68 rating
Manufacturing Advantages
- 10-Day Prototypes with full test reports
- 25-Day Volume Production (30k panels/month capacity)
- 45% cost savings vs. North American fabs
- Free HDI DFM analysis (IPC-2226 compliant)
- Signal integrity simulations (HFSS 3D)
- On-site failure forensics
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