6 Layer FR4 Power Device PCB with Immersion Gold KB6160

• Number of layers: 6
• Plate: ITEQ (158A)
• Board thickness: 2.5±0.25mm
• Size: 413.00mm × 142.00mm
• Minimum aperture: 0.3mm
• Line width and distance: 0.1mm/0.1mm
• Surface treatment: Immersion gold
• Minimum hole copper thickness: 25um
• Surface copper thickness: 1oz

• High Glass Transition Temperature (Tg): 150Tg or 170Tg
• High Decomposition Temperature (Td): >345°C
• Low Coefficient of Thermal Expansion (CTE): 2.5%-3.8%
• Dielectric Constant (@1 GHz): 4.25-4.55
• Dissipation Factor (@1 GHz): 0.016
• UL rated (94V-0, CTI = 3 minimum)
• Compatible with standard and lead-free assembly

• Laminate thickness: 0.005" to 0.125"
• Pre-preg thicknesses (after lamination):
  • 1080 glass style: 0.0022"
  • 2116 glass style: 0.0042"
  • 7628 glass style: 0.0075"

FR-4 is the standard material for printed circuit boards, featuring copper foil laminated to one or both sides of an epoxy panel. These copper clad laminates are used in various applications including:

• Printed circuit boards
• Relays and switches
• Standoffs and busbars
• Washers and arc shields
• Transformers and screw terminal strips

FR4 PCBs offer exceptional thermal stability with these key properties:

• Withstands wide temperature ranges without warping or delamination
• Glass Transition Temperature (Tg) of 130-180°C maintains mechanical integrity
• Low Coefficient of Thermal Expansion (CTE) of 12-18 ppm/°C reduces stress
• Compatible with standard soldering and reflow processes
• Flame retardant properties meet safety requirements

FR4 material consists of woven fiberglass cloth impregnated with epoxy resin, offering excellent dimensional stability, electrical insulation, and mechanical strength for demanding applications in consumer electronics, telecommunications, automotive, and industrial equipment.