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Vurgulamak
Multilayer glass epoxy fr4 pcb
,BGA glass epoxy fr4 pcb
,BGA microwave pcb
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MalzemeFr4
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Kalınlık1.6 mm
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Tg180
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Katman10l
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Yüzey kaplamasıHasl, Enig, Daldırma Gümüş, OSP
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BGA sahası0.35 mm
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Boyut52*68 mm
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Çarpışma≤0,3
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Maks. Panel boyutu600mm x 1200mm
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Place of OriginShenzhen,China
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Marka adıONESEINE
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SertifikaISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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FiyatUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T, Western Union
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Supply Ability1000000000pcs/mon
FR4 High TG 180 Multilayer PCB 10L with BGA 0.35mm Pitch
Multilayer Microwave TG 180 Glass Epoxy FR4 PCB Printed Circuit Board With BGA
Product Specifications
| Attribute | Value |
|---|---|
| Material | FR4 |
| Thickness | 1.6mm |
| TG | 180 |
| Layer | 10L |
| Surface Finish | HASL, ENIG, Immersion Silver, OSP |
| Bga Pitch | 0.35mm |
| Size | 52*68 mm |
| Warpage | ≤0.3% |
| Max. Panel Size | 600mm x 1200mm |
Standard FR4 TG180 Multilayer PCB With BGA
Quick Details: Material: FR4 | Layer: 8 | Thickness: 1.2mm | Surface finish: Immersion gold | Board size: 18*22cm | Application: Communication | Solder mask: Green | Silk screen: White
Multilayer PCB Construction
- Top silkscreen/Legend: Identifies component pads, board part number, and other markings
- Top Surface finishing: Protects exposed copper from oxidation
- Top Soldermask: Prevents oxidation and controls solder application during SMT process
- Top Trace: Copper etched according to design specifications
- Substrate/Core material: Non-conductive FR4 base
- Prepreg (PP) and middle layers for power, ground, and signal routing
- Bottom layers mirror top layer construction when present
Multi-layer PCBs (4L, 6L, 8L, 10L, 12L up to 32L) allow engineers to separate functions across layers for power distribution, signal transfer, EMI shielding, and component assembly. High Tg FR4 material is essential for boards with more than 8 layers.
Manufacturing Process
Multilayer PCBs are created by laminating alternating layers of prepreg and core materials under high temperature and pressure. This process ensures complete resin encapsulation of conductors and proper bonding between layers. The stackup begins with malleable prepreg layers that melt during lamination to form a solid, durable board structure.
High TG PCB Advantages
- Excellent heat dissipation (3-4 times better than standard FR-4)
- Superior thermal and insulation reliability
- Enhanced processability with low Z-axis CTE
High Temperature Performance
With a glass transition temperature of 180°C, these PCBs maintain structural integrity in high-temperature environments like power electronics, automotive systems, aerospace applications, and industrial equipment. The specialized FR4 laminate offers improved thermal stability, reduced thermal expansion, and greater mechanical strength compared to standard materials.
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