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Vurgulamak
HDI photoresist pcb
,Epoxy photoresist pcb
,10 Layer glass epoxy pcb board
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Katman10
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TipHDI PCB
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MalzemeFr4
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Devre kartıTek elden çözümler
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Tg150-160
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ÜreticilerÇin
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Place of OriginShenzhen,China
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Marka adıONESEINE
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SertifikaISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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FiyatUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T, Western Union
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Supply Ability1000000000pcs/mon
10 Layer HDI PCB High TG FR4 Circuit Board
10 Layer Glass Epoxy HDI Photoresist PCB FR4 Circuit Board One Stop Solution
Product Specifications
| Attribute | Value |
|---|---|
| Layer | 10 |
| Type | HDI PCB |
| Material | Fr4 |
| Circuit Board | One-stop Solutions |
| TG | 150-160 |
| Manufacturers | China |
PCB Technical Details
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Material | Isola fr4 | Surface finish | ENIG |
| Layer | 10 | Special | HDI PCB |
| Thickness | 2.3MM | Copper | 1OZ |
| Board size | 8*9CM | Solder mask | Green |
| Silkscreen | White | Min line | 2mil |
| Min hole | 3mil | Laser line | Yes |
| Buried hole | Yes | Blind hole | Yes |
Applications
- Petrochemical industry
- Mine industry
- Industrial equipment
- GPS systems
- Automotive electronics
- Instrumentation
- Medical equipment
- Aircraft systems
- Military weapons
- Missiles and satellites
- DC-DC Power Converters
- High Brightness LED
- Power Supply circuits
High TG PCB Overview
High Tg refers to high heat resistance in printed circuit boards. Standard Tg is typically above 130°C, while high Tg PCBs exceed 170°C. These specialized boards offer superior performance in demanding thermal environments.
Key Features
- Excellent heat dissipation (3-4 times better than standard FR-4)
- Superior thermal and insulation reliability
- Enhanced processability with low Z-CTE
- Improved mechanical strength at elevated temperatures
- Better dimensional stability under thermal stress
- Reduced moisture absorption
Technical Advantages
High TG PCBs maintain structural integrity at temperatures between 150°C to 180°C, making them ideal for lead-free soldering processes and high-power applications. The specialized materials used in these boards provide:
- Lower coefficient of thermal expansion (CTE)
- Improved adhesion under thermal cycling
- Enhanced chemical resistance
- Superior long-term reliability in harsh environments
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