16 Layer Glass Epoxy High TG PCB 2.0mm Electronic Circuit Board
Product Specifications
Attribute |
Value |
Layer |
16 |
Type |
High Speed Design |
Material |
High TG PCB |
Thickness |
2.0mm |
Thermal Conductivity |
0.3W/mK |
Silkscreen Color |
White, Black, Yellow |
Usage |
OEM Electronics |
Copper Thickness |
20Z |
Product Details
High Speed Design 16 Layer High TG PCB for Electronic Equipment
Quick Specifications
- Brand Name: ONESEINE/Customized
- Min. Order Quantity: No minimum
- Supply Ability: 30~50 thousand ㎡/Month
- Port: Shenzhen
- Service: EMS/OEM/ODM
- Base Material: High Tg FR4
- Copper Thickness: 1oz
- Board Thickness: 2.0mm
- Solder Mask Color: Green (customizable)
- Silkscreen Color: White (customizable)
- Surface Finishing: Immersion Gold
- Application Industry: Industrial Control
- Outer Line width/space: 4/4mil
- Inner Line width/space: 3.5/3.5mil
- Min. Hole Size: 0.75mm
- Test Method: 100% E-Test
- Standard: IPC-Class2/Class 3
Applications
Ideal for demanding applications in:
- Petrochemical industry
- Mining industry
- Industrial equipment
- GPS and automotive systems
- Instrumentation and medical equipment
- Aircraft and military applications
- DC-DC Power Converters
- High Brightness LED systems
- Power supply circuits
What is High TG PCB?
High Tg PCBs (glass transition temperature above 170°C) offer superior performance in high-temperature environments compared to standard PCBs (Tg ~130°C). These advanced circuit boards maintain dimensional stability and mechanical integrity under thermal stress, making them essential for modern high-performance electronics.
Key Advantages
- Excellent heat dissipation (3-4 times better than standard FR-4)
- Superior thermal and insulation reliability
- Enhanced processability with low Z-CTE
- Improved resistance to moisture and chemicals
- Better mechanical strength at elevated temperatures
- Reduced thermal expansion for stable performance
Technical Overview
High TG PCBs utilize specialized laminates with thermally stable resin systems that maintain structural integrity at temperatures up to 180°C. The manufacturing process incorporates controlled lamination profiles, advanced copper plating techniques, and high-temperature compatible materials to ensure reliable performance in demanding applications.