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Vurgulamak
FR408 HDI PCB Fabrication
,1.6mm HDI PCB Fabrication
,FR408 electronic prototype board
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Layer6
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Thickness1.6mm
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MaterialFR408
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Surface FinishENIG
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ApplicationIndustrial Control
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Min Line Space8mil
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Surface TechnicsImmersion Gold 2U'
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Pcb TypeRigid PCB; Flexible PCB; Rigid-flex PCB
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Place of OriginShenzhen,China
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Marka adıONESEINE
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SertifikaISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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FiyatUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T, Western Union
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Supply Ability1000000000pcs/mon
6 Layer FR408 HDI PCB 1.6mm ENIG Industrial Control Board
FR408 Industrial Control HDI PCB Fabrication 6 Layer 1.6mm Electronic Prototype Board
Product Specifications
| Attribute | Value |
|---|---|
| Layer | 6 |
| Thickness | 1.6mm |
| Material | FR408 |
| Surface Finish | ENIG |
| Application | Industrial Control |
| Min Line Space | 8mil |
| Surface Technics | Immersion Gold 2U' |
| PCB Type | Rigid PCB; Flexible PCB; Rigid-flex PCB |
Detailed PCB Parameters
6 Layer FR408 1.6mm ENIG Industrial Control HDI PCB Board
- Number of layers: 6
- Board thickness: 1.6+/-0.16mm
- Size: 450mm*450mm
- Plate used: Lianmao (IT180A)
- Minimum aperture: 0.2mm
- Surface treatment: Immersion gold
- Gold thickness: 1-3u"
- Minimum hole copper: 20um
- Minimum table copper: 35um
- Impedance tolerance: ±10%
- Minimum line width/distance: 0.12mm/0.097mm
HDI PCB Technology Overview
HDI (High-Density Interconnect) PCB technology enables densely packed components and high-speed signal transmission in advanced electronic devices. This technology offers superior circuitry density compared to traditional PCBs, allowing for enhanced functionality and miniaturization.
Key Features of HDI PCBs
- Microvias: Smaller, densely packed via structures (typically <150 microns) that can be stacked for multi-layer interconnections
- Sequential Build-Up: Layers laminated individually for increased density and finer trace routing
- Laser Drilling: Precision creation of microvias for complex interconnect patterns
- High-Frequency Performance: Optimized for high-speed data transmission
- Miniaturization: Enables compact designs for portable electronics
Industry Applications
HDI PCB technology is widely used across multiple industries requiring advanced circuitry solutions:
- Mobile Devices: Smartphones, tablets, and wearables
- Computing & Networking: Laptops, servers, routers, and data centers
- Medical Equipment: Diagnostic machines, imaging systems, and monitoring devices
- Automotive Electronics: ADAS, infotainment, and vehicle connectivity systems
- Aerospace & Defense: Avionics, satellites, and radar systems
- Industrial IoT: Automation, smart devices, and environmental monitoring
Automotive Implementation Challenges
While offering significant benefits, implementing HDI PCB technology in automotive applications presents unique challenges:
- Reliability under harsh environmental conditions (temperature, vibration, moisture)
- Maintaining signal integrity for high-speed data transmission
- Effective thermal management with increased power density
- Complex manufacturing processes requiring specialized expertise
- Balancing performance requirements with cost considerations
- Meeting stringent automotive regulatory standards
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