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10 Layer HDI PCB for Automotive with ENIG Finish

10 Layer HDI PCB for Automotive with ENIG Finish

Ürünler - HDI PCB üretimi
  • Vurgulamak

    Interconnect HDI PCB Fabrication

    ,

    ENIG HDI PCB Fabrication

    ,

    ENIG interconnect pcb

  • Product description
    Car driving recorder HDI 10 layer Fr4 Base PCB
  • Layers
    10
  • Type
    HDI
  • Base Material
    Fr4
  • Surface Finish
    ENIG
  • Stack Up
    2-6-2
  • Silkscreen Color
    White, Black, Yellow, etc.
  • Application
    automotive
  • Place of Origin
    Shenzhen,China
  • Marka adı
    ONESEINE
  • Sertifika
    ISO9001,ISO14001
  • Model Number
    ONE-102
  • Minimum Order Quantity
    1pcs
  • Fiyat
    USD0.1-1000
  • Packaging Details
    Vacuun bag
  • Delivery Time
    5-8 working days
  • Payment Terms
    T/T, Western Union
  • Supply Ability
    1000000000pcs/mon

10 Layer HDI PCB for Automotive with ENIG Finish

Fiyat Al Şimdi başvurun
10 Layer HDI PCB Fabrication Interconnect Circuit Board ENIG Surface
Attribute Value
Product description Car driving recorder HDI 10 layer Fr4 Base PCB
Layers 10
Type HDI
Base Material Fr4
Surface Finish ENIG
Stack Up 2-6-2
Silkscreen Color White, Black, Yellow, etc.
Application Automotive
Car Driving Recorder HDI 10 Layer Fr4 Base PCB Specifications
PCB Parameters:
Material: Fr4
Brand: Oneseine
Layers: 10
Surface finish: ENIG
Copper: 1OZ
Technology: 2 step
Board thickness: 2.0mm
Board size: 80*60mm
HDI PCB Design Guidelines
Ensuring Proper Stitching Vias or Ground Vias:
  • Determine via spacing and distribution based on signal frequency requirements and desired isolation levels
  • Place vias regularly along signal traces for effective coupling with ground planes
  • Connect vias to solid ground planes without interruptions for optimal return paths
  • Select appropriate via diameter and aspect ratio for conductivity and thermal dissipation
  • Minimize via stub lengths to reduce impedance discontinuities and signal reflections
  • Consider ground via arrays for enhanced isolation and reduced return path inductance
  • Perform signal integrity analysis through simulation to validate via effectiveness
Determining Transmission Line Characteristic Impedance:
  • Use empirical formulas for approximate calculations in standard configurations
  • Employ field solver simulations (Ansys HFSS, CST Studio Suite) for precise results in complex designs
  • Consider layer stackup, trace geometry, and dielectric properties in calculations
HDI PCB Applications
  • Mobile Devices: Smartphones, tablets with integrated processors and sensors
  • Computing Equipment: Laptops, servers, and networking devices for high-speed data
  • Medical Devices: Diagnostic machines, imaging systems, and portable equipment
  • Automotive Electronics: ADAS, infotainment, and vehicle connectivity systems
  • Aerospace/Defense: Avionics, satellites, and military communication equipment
  • Industrial IoT: Automation systems, smart devices, and environmental monitoring
Automotive HDI PCB Implementation Challenges
  • Ensuring reliability under harsh environmental conditions (temperature, vibration, moisture)
  • Maintaining signal integrity with high-speed data transmission requirements
  • Effective thermal management for components with increased power density
  • Managing manufacturing complexity of sequential build-up processes
  • Balancing advanced technology costs with performance requirements
  • Meeting stringent automotive regulatory standards and certifications
10 Layer HDI PCB for Automotive with ENIG Finish 0
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