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Vurgulamak
Copper Clad HDI PCB Fabrication
,1.0mm HDI PCB Fabrication
,Multilayer hdi pcb board
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Layers1-16
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Impedance Control50ohm +/-10%
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Portshenzhen
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Surface Mount PadCopper, Gold, Tin, Silver
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Component SourcingYes
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Min Line Space8mil
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Thickness0.2mm-6.0mm
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Board Thickness1.2mm
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Place of OriginShenzhen,China
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Marka adıONESEINE
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SertifikaISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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FiyatUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T,Western Union
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Supply Ability1000000000pcs/mon
HDI PCB Fabrication 1.0mm FR4 Multilayer Circuit Board
| Attribute | Value |
|---|---|
| Layers | 1-16 |
| Impedance Control | 50ohm +/-10% |
| Port | Shenzhen |
| Surface Mount Pad | Copper, Gold, Tin, Silver |
| Component Sourcing | Yes |
| Min Line Space | 8mil |
| Thickness | 0.2mm-6.0mm |
| Board Thickness | 1.2mm |
FR4 Copper Clad Laminate Multilayer HDI 1.0mm PCB designed for mobile phone applications and other compact electronic devices.
- Material: FR4
- Layer: 4
- Surface finish: Immersion gold
- Copper weight: 1oz
- Board size: 4.5*3cm
- Total thickness: 1.6mm
- Min line width and space: 3mil
- Min hole: 0.15mm
HDI (High Density Interconnector) PCBs utilize micro blind buried hole technology to create compact circuit boards for small-capacity applications. These boards feature microvias as interconnects between layers to accommodate high input/output density in advanced packages.
- Reduces PCB cost while increasing line density
- Enhanced electrical performance and signal integrity
- Improved reliability and thermal properties
- Better RFI/EMI/ESD protection
- Increased design efficiency
| Feature | Technical Specification |
|---|---|
| Number of layers | 4 - 22 layers standard, 30 layers advanced |
| Technology highlights | Multilayer boards with higher connection pad density, finer lines/spaces, and smaller via holes |
| HDI builds | 1+N+1, 2+N+2, 3+N+3, 4+N+4, any layer in R&D |
| Materials | FR4 standard, FR4 high performance, Halogen free FR4, Rogers |
| Copper weights (finished) | 18um - 70um |
| Minimum track and gap | 0.075mm / 0.075mm |
| PCB thickness | 0.40mm - 3.20mm |
| Surface finishes available | OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers |
Widely used in mobile phones, digital cameras, MP3/MP4 players, computers, automotive electronics, and other compact digital devices where space optimization is critical.
FR4 PCBs offer excellent thermal stability, high mechanical strength, moisture resistance, and chemical resistance. The material consists of copper foil laminated onto a woven fiberglass substrate with epoxy resin, providing good dimensional stability and low electrical conductivity.
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