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8 Layer HDI PCB with Blind Vias EM370D FR4 Prototype

8 Layer HDI PCB with Blind Vias EM370D FR4 Prototype

Ürünler - HDI PCB üretimi
  • Vurgulamak

    Multilayer HDI PCB Fabrication

    ,

    EM370D HDI PCB Fabrication

    ,

    EM370D printed circuit board fabrication

  • Raw Material
    EM370(D)
  • Min. Solder Mask Clearance
    0.08mm
  • Hole Tolerance
    PTH: +/-3mil NPTH: +/-2mil
  • Pcb Kind
    HDI PCB
  • Produc Name
    FR4 pcb prototype machine
  • Peelable Mask
    0.3-0.5mm
  • Silkscreen
    White, Black, Yellow
  • Blind Hole
    L2-L3 0.2MM
  • Place of Origin
    Shenzhen,China
  • Marka adı
    ONESEINE
  • Sertifika
    ISO9001,ISO14001
  • Model Number
    ONE-102
  • Minimum Order Quantity
    1pcs
  • Fiyat
    USD0.1-1000
  • Packaging Details
    Vacuun bag
  • Delivery Time
    5-8 working days
  • Payment Terms
    T/T, Western Union
  • Supply Ability
    1000000000pcs/mon

8 Layer HDI PCB with Blind Vias EM370D FR4 Prototype

Fiyat Al Şimdi başvurun
Multilayer HDI PCB Fabrication EM370D Printed Circuit Board Custom
Product Specifications
Attribute Value
Raw Material EM370(D)
Min. Solder Mask Clearance 0.08mm
Hole Tolerance PTH: ±3mil NPTH: ±2mil
PCB Kind HDI PCB
Product Name FR4 PCB prototype machine
Peelable Mask 0.3-0.5mm
Silkscreen White, Black, Yellow
Blind Hole L2-L3 0.2MM
8 Layer Multilayer HDI PCB with Blind Vias
General Information
Layers: 8
Material: FR4
Thickness: 2.0MM
Surface finish: ENIG
Special features: Blind hole (L1-L2, L3-L4, L5-L6), vias filled and capped
Board size: 2×6CM
Solder mask: No
Silk screen: White
Delivery time: 10 days for sample and small/medium batch
Packaging: Inner vacuum packing/plastic bag, outer standard carton packing
Blind Vias Technology
Blind vias connect one outer layer with at least one inner layer. Each connection level requires a separate drill file. The aspect ratio (hole depth to drill diameter) must be ≤ 1. The smallest hole determines the maximum distance between outer and corresponding inner layers.
Keywords: Microvia, Via-in-Pad
HDI PCB Technology
HDI boards represent one of the fastest growing PCB technologies, featuring blind/buried vias and microvias (≤0.006 diameter) for higher circuit density than traditional boards. Six HDI board types include:
  • Through vias from surface to surface
  • With buried vias and through vias
  • Two or more HDI layers with through vias
  • Passive substrate with no electrical connection
  • Coreless construction using layer pairs
  • Alternate coreless constructions
Special HDI Technologies
  • Edge plating for shielding and ground connection
  • 40μm minimum track width/spacing in mass production
  • Stacked microvias (plated copper or conductive paste filled)
  • Cavities, countersunk holes, and depth milling
  • Multi-color solder resist options
  • Low-halogen materials in standard and high Tg range
  • Low-DK materials for mobile devices
  • All industry-standard PCB surfaces available
HDI PCB Design Guidelines
Stitching Vias/Ground Vias Implementation:
  1. Determine optimal via spacing based on frequency requirements
  2. Place vias regularly along signal traces for effective coupling
  3. Connect vias directly to solid ground plane without interruptions
  4. Select appropriate via diameter and aspect ratio
  5. Minimize via stub lengths using blind/buried vias
  6. Consider ground via arrays for enhanced isolation
  7. Perform signal integrity analysis and simulations
Characteristic Impedance Calculation
Two primary methods for determining transmission line impedance:
1. Empirical Formulas:
Microstrip formula: Zc = (87/√εr) × log(5.98h/W + 1.74b/W)
Where Zc=impedance, εr=dielectric constant, h=dielectric height, W=trace width, b=ground plane separation
2. Field Solver Simulations:
For precise results, use specialized tools (Ansys HFSS, CST Studio Suite, Sonnet) that account for layer stackup, trace geometry, and material properties.
Automotive Electronics Challenges
Implementing HDI PCBs in automotive applications presents several challenges:
  • Reliability: Must withstand temperature variations, vibrations, and moisture
  • Signal Integrity: Managing crosstalk and impedance in high-density designs
  • Thermal Management: Effective heat dissipation in compact designs
  • Manufacturing Complexity: Tight tolerances and specialized processes
  • Cost Considerations: Balancing advanced features with production expenses
  • Regulatory Compliance: Meeting stringent automotive standards
8 Layer HDI PCB with Blind Vias EM370D FR4 Prototype 0
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