Half Hole HDI PCB Fabrication FR4 8mil Immersion Gold

• Number of layers: 2
• Material: FR-4
• Board thickness: 1.0mm
• Board used: FR4
• Surface treatment: HASL LF
• Minimum aperture: 0.25mm
• Outer line width/line spacing: 6/6mil
• Inner line width/line spacing: 8/8mil
• Features: thick copper plate

• High Glass Transition Temperature (Tg) (150Tg or 170Tg)
• High Decomposition Temperature (Td) (> 345º C)
• Low Coefficient of Thermal Expansion (CTE) (2.5%-3.8%)
• Dielectric Constant (@1 GHz): 4.25-4.55
• Dissipation Factor (@ 1 GHz): 0.016
• UL rated (94V-0, CTI = 3 minimum)
• Compatible with standard and lead-free assembly
• Laminate thickness available from 0.005" to 0.125"
• Pre-preg thicknesses available (approximate after lamination):
• (1080 glass style) 0.0022"
• (2116 glass style) 0.0042"
• (7628 glass style) 0.0075"

FR-4 is a common material for printed circuit boards (PCBs). A thin layer of copper foil is typically laminated to one or both sides of an FR-4 glass epoxy panel. These are commonly referred to as copper clad laminates. The copper thickness or copper weight can vary and so is specified separately.

FR-4 is also used in the construction of relays, switches, standoffs, busbars, washers, arc shields, transformers and screw terminal strips.

The thermal stability of FR4 PCBs refers to their ability to withstand and operate under different temperature conditions without experiencing significant degradation or performance issues.

FR4 PCBs are designed to have good thermal stability, meaning they can handle a wide temperature range without warping, delaminating, or suffering from electrical or mechanical failures.

• Glass Transition Temperature (Tg): FR4 PCBs typically have a Tg value around 130-180°C, which means they can withstand elevated temperatures without significant changes in their mechanical properties.
• Coefficient of Thermal Expansion (CTE): FR4 PCBs have a relatively low CTE (12-18 ppm/°C), ensuring they can withstand thermal cycling without excessive stress on components and solder joints.
• Thermal Conductivity: While not highly conductive, FR4 provides adequate heat dissipation for most applications. Thermal performance can be enhanced with thermal vias, heat sinks, or thermal pads.
• Soldering Compatibility: FR4 PCBs can withstand standard soldering and reflow processes without significant damage or dimensional changes.

FR4 PCBs are known for their excellent thermal stability, high mechanical strength, and resistance to moisture and chemicals. These properties make them suitable for a wide range of applications, including consumer electronics, telecommunications, automotive, and industrial equipment.