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Vurgulamak
0.1mm hdi rigid flex pcb
,High TG hdi rigid flex pcb
,HDI power circuit board
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Product TypePower Products pcb board
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Materialfr4
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Board TypeHigh TG PCB Board
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Minimum Hole Size0.1mm
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Applicationautomotive
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Number Of Layers2 layers
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Impedance ControlAvailable
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PackageVacuum Package.
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Place of OriginShenzhen,China
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Marka adıONESEINE
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SertifikaISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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FiyatUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T, Western Union
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Supply Ability1000000000pcs/mon
0.1mm High TG HDI Rigid Flex PCB for Automotive Power Supply
0.1mm High TG HDI Rigid Flex PCB Power Circuit Board For Automotive
Product Specifications
| Attribute | Value |
|---|---|
| Product Type | Power Products PCB Board |
| Material | FR4 |
| Board Type | High TG PCB Board |
| Minimum Hole Size | 0.1mm |
| Application | Automotive |
| Number of Layers | 2 layers |
| Impedance Control | Available |
| Package | Vacuum Package |
Power Products Automated Equipment Power Supply High TG HDI PCB Board
PCB Parameters
- Board thickness: 1.6+/-0.15mm
- Brand: ONESEINE
- Size: 52*20/16mm
- Plate used: Shengyi S1141
- Minimum aperture: 0.85um
- Surface treatment: Immersion gold
- Minimum hole copper: 20um
- Minimum line width/spacing: 0.08mm/0.075mm
- Gold thickness: >1U"
- End product: power supply for automated production equipment
HDI PCB Design Techniques for Signal Integrity
- Controlled Impedance Design: Match characteristic impedance through careful trace width, spacing, and layer stackup design to prevent signal reflections and EMI.
- Differential Pair Routing: Maintain consistent spacing and length matching for noise reduction and signal balance in high-speed data transmission.
- Power and Ground Planning: Implement dedicated planes and strategic decoupling capacitors for noise reduction and stable voltage levels.
- Signal Layer Planning: Group high-speed signals between power/ground planes and separate analog/digital signals to minimize interference.
- Signal Escape Routing: Utilize microvias and stitching vias for efficient high-density routing while maintaining impedance continuity.
- EMI Shielding: Incorporate ground planes, shielding cans, and proper trace placement to minimize electromagnetic interference.
- Design for Manufacturability: Collaborate early with manufacturers to optimize material selection and fabrication processes.
HDI PCB Applications
- Mobile Devices: Smartphones, tablets with integrated processors, memory, and wireless modules.
- Computing/Networking: Laptops, servers, routers supporting high-speed data processing.
- Medical Devices: Diagnostic machines, imaging systems, and portable medical equipment.
- Automotive Electronics: ADAS, infotainment systems, and vehicle connectivity solutions.
- Aerospace/Defense: Avionics, satellites, and military communication systems.
- Industrial IoT: Automation systems, smart devices for energy and environmental monitoring.
Challenges in Automotive HDI PCB Implementation
- Reliability: Materials must withstand extreme temperatures, vibrations, and moisture in automotive environments.
- Signal Integrity: Managing crosstalk and impedance matching becomes more complex with miniaturization.
- Thermal Management: Higher circuit density requires effective heat dissipation solutions.
- Manufacturing Complexity: Requires specialized equipment for laser drilling and fine-pitch assembly.
- Cost Considerations: Advanced materials and processes increase production expenses.
- Regulatory Compliance: Meeting strict automotive safety and reliability standards.
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