Blue Ceramic Multilayer FPGA HDI PCB Fabrication Design 2OZ for Automobile
Product Specifications
Attribute |
Value |
Material |
Isola FR408 / FR408HR |
Thickness |
0.8MM |
Copper Weight |
2OZ |
Application |
Automobile |
Board Thk |
1.0MM |
Surface Finishing |
Immersion Gold |
Min Hole Size |
0.2mm |
Trade Terms |
EX-WORK, DDO TO DOOR, FOC |
Product Description
Blue Ceramic Multilayer PCB Board Fabrication Isola FR408 / FR408HR
Key Specifications
- Base Material: Isola
- Layer: 2
- Thickness: 0.8MM
- Copper weight: 2OZ
- Surface finish: ENIG
Applications
- Automobile
- Backplanes
- Servers and Networking
- Telecommunications
- Data Storage
- Heavy Copper Application
High-Performance Laminate & Prepreg Materials
Isola manufactures prepreg and Copper Clad Laminates (CCL), the primary materials used in the construction of multilayer printed circuit boards. Prepreg is a dielectric material that provides electrical insulation and other properties, manufactured by impregnating fiberglass fabric with specially formulated resins.
CCL consists of an inner layer of prepreg laminated with copper foil. PCB fabricators use prepreg and CCL to construct multilayered PCBs through a complex process involving etching, layering, drilling, and plating to create intricate interconnection devices.
Technical Parameters
- Layers: 12-26
- Material types: FR-4, CEM-1, Isola, High TG, FR4 Halogen Free, Rogers
- Board thickness: 0.21mm to 7.0mm
- Copper thickness: 0.5 OZ to 6 oz
- Max. Board Size: 580mm×1100mm
- Min. Drilled Hole Size: 0.2 mm (8 mil)
- Surface finishing options: HASL, HAL, Chemical tin, Immersion Silver/Gold, OSP, Gold plating
- Certifications: UL, ISO 9001, ISO 14001
Multilayer PCB Stack-Up
The stack-up configuration determines the electrical performance, signal integrity, impedance control, and thermal characteristics of the board. A typical multilayer PCB stack-up includes:
- Signal Layers: Copper traces carrying electrical signals
- Power and Ground Planes: Provide stable reference and distribution
- Prepreg Layers: Insulating material between signal layers
- Core Layer: Central layer providing mechanical strength
- Surface Layers: Outermost layers for component connectivity
- Soldermask and Silkscreen Layers: Protection and component markings
Multilayer PCB Types
- Standard Multilayer PCB (4-8 layers)
- High-Density Interconnect (HDI) PCB
- Flex and Rigid-Flex PCB
- Sequential Lamination PCB
- Metal Core PCB
- RF/Microwave PCB
Industry Applications
Multilayer PCBs are essential in:
- Consumer Electronics (smartphones, tablets, TVs)
- Telecommunications (routers, switches, modems)
- Automotive Electronics (engine control, ADAS)
- Industrial Equipment (control systems, robotics)
- Aerospace and Defense (avionics, radar systems)
- Medical Devices (diagnostic tools, imaging systems)
- Power Electronics (inverters, converters)