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Automotive HDI PCB 2OZ Copper ENIG Finish FR408 Material

Automotive HDI PCB 2OZ Copper ENIG Finish FR408 Material

  • Vurgulamak

    Ceramic HDI PCB Fabrication

    ,

    2OZ HDI PCB Fabrication

    ,

    Ceramic fpga pcb design

  • Material
    Isola FR408 / FR408HR
  • Thickness
    0.8MM
  • Copper Weight
    2OZ
  • Application
    Automobile
  • Board Thk
    1.0MM
  • Surface Finishing
    Immersion Gold
  • Min Hole Size
    0.2mm
  • Trade Terms
    EX-WORK, DDO TO DOOR, FOC
  • Place of Origin
    Shenzhen,China
  • Marka adı
    ONESEINE
  • Sertifika
    ISO9001,ISO14001
  • Model Number
    ONE-102
  • Minimum Order Quantity
    1pcs
  • Fiyat
    USD0.1-1000
  • Packaging Details
    Vacuun bag
  • Delivery Time
    5-8 working days
  • Payment Terms
    T/T,Western Union
  • Supply Ability
    1000000000pcs/mon

Automotive HDI PCB 2OZ Copper ENIG Finish FR408 Material

Blue Ceramic Multilayer FPGA HDI PCB Fabrication Design 2OZ for Automobile
Product Specifications
Attribute Value
Material Isola FR408 / FR408HR
Thickness 0.8MM
Copper Weight 2OZ
Application Automobile
Board Thk 1.0MM
Surface Finishing Immersion Gold
Min Hole Size 0.2mm
Trade Terms EX-WORK, DDO TO DOOR, FOC
Product Description

Blue Ceramic Multilayer PCB Board Fabrication Isola FR408 / FR408HR

Key Specifications
  • Base Material: Isola
  • Layer: 2
  • Thickness: 0.8MM
  • Copper weight: 2OZ
  • Surface finish: ENIG
Applications
  • Automobile
  • Backplanes
  • Servers and Networking
  • Telecommunications
  • Data Storage
  • Heavy Copper Application
High-Performance Laminate & Prepreg Materials

Isola manufactures prepreg and Copper Clad Laminates (CCL), the primary materials used in the construction of multilayer printed circuit boards. Prepreg is a dielectric material that provides electrical insulation and other properties, manufactured by impregnating fiberglass fabric with specially formulated resins.

CCL consists of an inner layer of prepreg laminated with copper foil. PCB fabricators use prepreg and CCL to construct multilayered PCBs through a complex process involving etching, layering, drilling, and plating to create intricate interconnection devices.

Technical Parameters
  • Layers: 12-26
  • Material types: FR-4, CEM-1, Isola, High TG, FR4 Halogen Free, Rogers
  • Board thickness: 0.21mm to 7.0mm
  • Copper thickness: 0.5 OZ to 6 oz
  • Max. Board Size: 580mm×1100mm
  • Min. Drilled Hole Size: 0.2 mm (8 mil)
  • Surface finishing options: HASL, HAL, Chemical tin, Immersion Silver/Gold, OSP, Gold plating
  • Certifications: UL, ISO 9001, ISO 14001
Multilayer PCB Stack-Up

The stack-up configuration determines the electrical performance, signal integrity, impedance control, and thermal characteristics of the board. A typical multilayer PCB stack-up includes:

  • Signal Layers: Copper traces carrying electrical signals
  • Power and Ground Planes: Provide stable reference and distribution
  • Prepreg Layers: Insulating material between signal layers
  • Core Layer: Central layer providing mechanical strength
  • Surface Layers: Outermost layers for component connectivity
  • Soldermask and Silkscreen Layers: Protection and component markings
Multilayer PCB Types
  • Standard Multilayer PCB (4-8 layers)
  • High-Density Interconnect (HDI) PCB
  • Flex and Rigid-Flex PCB
  • Sequential Lamination PCB
  • Metal Core PCB
  • RF/Microwave PCB
Industry Applications

Multilayer PCBs are essential in:

  • Consumer Electronics (smartphones, tablets, TVs)
  • Telecommunications (routers, switches, modems)
  • Automotive Electronics (engine control, ADAS)
  • Industrial Equipment (control systems, robotics)
  • Aerospace and Defense (avionics, radar systems)
  • Medical Devices (diagnostic tools, imaging systems)
  • Power Electronics (inverters, converters)
Automotive HDI PCB 2OZ Copper ENIG Finish FR408 Material 0