High Density Interconnect HDI PCB Fabrication Blue Printed Circuit Board Assembly PCBA
Product Specifications
Attribute |
Value |
Number of layers |
4 |
Material |
FR4 |
Surface finish |
Gold finger |
Color |
Blue |
Application |
Arduino uno |
Function Test |
100% Functional test |
Conductor Space |
4 mil |
Plate Material |
Copper foil without glass fiber, FR4 |
4-Layer Blue Arduino Uno High Density Interconnect PCB Board
PCB Parameters
Number of layers: 4
Board thickness: 2+/-0.18mm
Size: 225mm*150mm
Board used: Shengyi (S1000-2)
Minimum aperture: 0.2mm
Surface treatment: Immersion gold
Minimum hole copper: 25um
Table copper thickness: 1OZ
Minimum line width/spacing: 0.085mm/0.085mm
HDI PCB Applications
- Mobile Devices: Smartphones, tablets, and other mobile devices benefit from HDI PCBs' compact size and high-density interconnects for integrating multiple functionalities.
- Computing and Networking Equipment: Laptops, servers, routers, and switches utilize HDI PCBs for high-speed data processing and network connectivity.
- Medical Devices: Diagnostic machines, imaging systems, and implantable devices leverage HDI technology for miniaturization without compromising functionality.
- Automotive Electronics: ADAS, infotainment systems, and vehicle connectivity systems use HDI PCBs for space-efficient integration of complex electronics.
- Aerospace and Defense: Avionics systems, satellites, and military communication equipment require HDI technology for space-constrained environments.
- Industrial and IoT Devices: Industrial automation, IoT devices, and smart home systems benefit from HDI PCBs' improved signal integrity and increased functionality.
Challenges in Automotive Electronics Implementation
Reliability and Durability: HDI PCBs must withstand harsh automotive conditions through careful material selection and design.
Signal Integrity: High-density designs require careful management of crosstalk, impedance matching, and signal degradation.
Thermal Management: Increased power densities demand effective heat dissipation solutions for reliable operation.
Manufacturing Complexity: Specialized processes like laser drilling and fine-pitch assembly require tight tolerances and expertise.
Cost Considerations: Advanced materials and processes increase production expenses while maintaining performance requirements.
Regulatory Compliance: Meeting automotive safety standards requires additional testing and validation processes.