High Precision HDI PCB Fabrication Impedance Control 94v0 Mcpcb Board
Product Specifications
Attribute |
Value |
Number of Layers |
6 |
Material |
FR4 |
Thickness |
1.6mm |
Type |
PCB Circuit Board |
Impedance |
Yes |
Service |
24Hours Technical Services |
Silk Screen Color |
White, Black, Yellow, Etc. |
Stack Up |
Anylayer |
Product Description
High Precision 6-layer Impedance Circuit Microvias PCB Board 94v0 Standard
PCB Parameters
- Number of layers: 6 layers
- Finished product thickness: 1.8mm
- Plate: FR-4
- Finished copper foil thickness: 35 μm
- Surface treatment: Immersion gold
- Minimum aperture: 0.6
HDI PCB Technology
HDI (High-Density Interconnect) PCBs represent advanced printed circuit board technology designed for densely packed components and high-speed signal transmission. These boards enable greater functionality and miniaturization in electronic devices through specialized manufacturing techniques.
Key Features
- Microvias: Smaller, densely packed via structures (typically <150μm diameter)
- Sequential Build-Up: Layers laminated individually for increased density
- Laser Drilling: Precision creation of complex interconnect patterns
- High-Frequency Performance: Optimized for high-speed data transmission
- Miniaturization: Enables compact device designs
Applications
- Mobile Devices: Smartphones, tablets, wearables
- Computing & Networking: Servers, routers, data centers
- Medical Equipment: Diagnostic machines, monitoring systems
- Automotive Electronics: ADAS, infotainment systems
- Aerospace & Defense: Avionics, radar systems
- Industrial IoT: Automation, smart devices
Automotive Implementation Challenges
While offering significant benefits, HDI PCB implementation in automotive applications presents unique challenges:
- Reliability under harsh environmental conditions
- Maintaining signal integrity with high-speed data
- Effective thermal management in compact spaces
- Complex manufacturing processes
- Cost considerations
- Regulatory compliance requirements