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Vurgulamak
ENIG 94vo circuit board
,Mcpcb 94vo circuit board
,ENIG mcpcb board
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ProductFr5 PCB
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Layer6 layer
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Surface FinishENIG
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QualityHigh quality
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Minimum Solder Mask Opening0.1 mm
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ShippingDHL UPS TNT Fedex EMS
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Quotation NeedGerber File
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Outline ProfileRout/ V-cut/ Bridge/ Stamp Hole
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Place of OriginShenzhen,China
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Marka adıONESEINE
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SertifikaISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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FiyatUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T, Western Union
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Supply Ability1000000000pcs/mon
6-Layer ENIG FR5 HDI PCB 1.55mm Thickness for High-Density Circuits
ENIG FR5 1.55MM HDI Mcpcb 94vo Circuit Board PCB Manufacturing
Product Specifications
| Attribute | Value |
|---|---|
| Product | Fr5 PCB |
| Layer | 6 layer |
| Surface Finish | ENIG |
| Quality | High quality |
| Minimum Solder Mask Opening | 0.1 mm |
| Shipping | DHL UPS TNT Fedex EMS |
| Quotation Need | Gerber File |
| Outline Profile | Rout/ V-cut/ Bridge/ Stamp Hole |
Technical Parameters
Layer count: 6
Materials: FR-5
Thickness: 1.55MM
Copper foil thickness: 35UM
Surface finish: ENIG 1U"
Min finish via dia: 0.25mm
Min width/Spacing: 0.152MM/0.97MM
Materials: FR-5
Thickness: 1.55MM
Copper foil thickness: 35UM
Surface finish: ENIG 1U"
Min finish via dia: 0.25mm
Min width/Spacing: 0.152MM/0.97MM
HDI PCB Design Guidelines
Follow these key considerations for optimal characteristic impedance in your HDI PCB design:
- PCB Material Selection: Choose materials with consistent dielectric constant for accurate impedance values
- Layer Stackup: Maintain uniform dielectric thickness and avoid abrupt changes in material
- Trace Geometry: Follow manufacturer guidelines for width, spacing, and thickness
- Differential Pairs: Maintain consistent trace dimensions for balanced impedance
- Via Design: Minimize vias in signal path and use controlled impedance vias when necessary
- Ground Plane Configuration: Ensure solid ground plane with proper stitching vias
- Manufacturing Tolerances: Account for production capabilities in your design
HDI PCB Applications
HDI technology enables advanced solutions across multiple industries:
- Mobile Devices (smartphones, tablets)
- Computing and Networking Equipment
- Medical Devices and Diagnostic Systems
- Automotive Electronics (ADAS, infotainment)
- Aerospace and Defense Systems
- Industrial Automation and IoT Devices
Automotive Implementation Challenges
Key considerations for HDI PCBs in automotive applications:
- Ensuring reliability under harsh environmental conditions
- Maintaining signal integrity with high-speed data transmission
- Effective thermal management for heat dissipation
- Managing manufacturing complexity and costs
- Meeting strict automotive regulatory standards
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