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Vurgulamak
microvias HDI PCB Fabrication
,35um HDI PCB Fabrication
,microvias hdi rigid flex pcb
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Product NameHigh Quality 6Layer PCB Board
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Product Attributes6L,35um,FR4,arduino uno r3,eagle,Available
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Thickness0.1-6.0mm
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Finished Copper1oz
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Number Of Layers1-48
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Layers2,4,6.8.10 and more
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Production NameOEM
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Item TypeHDI PCB
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Place of OriginShenzhen,China
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Marka adıONESEINE
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SertifikaISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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FiyatUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T, Western Union
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Supply Ability1000000000pcs/mon
6 Layer HDI PCB Board 35um FR4 for Arduino Uno R3
Microvias Rigid Flex HDI PCB Fabrication PCB Board 35um Customized
| Product Name | High Quality 6Layer PCB Board |
|---|---|
| Product Attributes | 6L,35um,FR4,arduino uno r3,eagle,Available |
| Thickness | 0.1-6.0mm |
| Finished Copper | 1oz |
| Number Of Layers | 1-48 |
| Layers | 2,4,6.8.10 and more |
| Production Name | OEM |
| Item Type | HDI PCB |
Any Layer HDI 6Layer PCB Board With Arduino Uno R3 Eagle Software Drawing
Product Parameters
- Number of layers: 6 layers
- Material: FR-4
- Finished product thickness: 1.20mm
- Finished copper foil thickness: 35UM
- Surface treatment: Immersion gold 1U"
- Minimum aperture: 0.2MM
- Minimum line width and distance: 0.1MM/0.1MM
HDI PCB Design Guidelines for Characteristic Impedance
- PCB Material Selection: Choose dielectric material with known, consistent dielectric constant for accurate impedance values.
- Layer Stackup: Maintain consistent dielectric thickness between signal layers and uniform stackup configuration.
- Trace Geometry: Follow manufacturer guidelines for trace width, spacing, and thickness to achieve desired impedance.
- Differential Pairs: Maintain consistent trace widths, spacing, and length matching for balanced impedance.
- Via Design: Minimize vias in signal path; use controlled impedance vias when necessary.
- Ground Plane Configuration: Ensure solid ground plane with proper stitching vias for signal integrity.
- Manufacturing Tolerances: Consider manufacturer capabilities for trace width, spacing, and dielectric thickness tolerances.
HDI PCB Applications
- Mobile Devices: Smartphones, tablets with integrated processors, memory, and wireless modules.
- Computing and Networking: Laptops, servers, routers, and data center equipment for high-speed data processing.
- Medical Devices: Diagnostic machines, imaging systems, and portable medical equipment.
- Automotive Electronics: ADAS, infotainment systems, and vehicle connectivity solutions.
- Aerospace and Defense: Avionics, satellites, radar systems, and military communication equipment.
- Industrial and IoT: Automation systems, smart home devices, and environmental monitoring solutions.
Challenges in Automotive HDI PCB Implementation
- Reliability: Withstanding harsh automotive environments including temperature variations and vibrations.
- Signal Integrity: Managing crosstalk and impedance matching in high-density designs.
- Thermal Management: Effective heat dissipation in high-power density applications.
- Manufacturing Complexity: Precision requirements for microvias and fine-pitch components.
- Cost Considerations: Balancing advanced technology requirements with production budgets.
- Regulatory Compliance: Meeting stringent automotive safety and reliability standards.
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