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Vurgulamak
CEM-3 hdi flex pcb
,FR4 hdi flex pcb
,CEM-3 hdi multilayer pcb
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Product Name2 Layer Black Soldermask PCB Board
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MaterialFR-4, FR-4 High Tg, Polyimide
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ColorBlack
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Tolerance Of Pcb±5%
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Pcb StandardIPC-A-610 D
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Bga7mil
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SpecialCan be customized
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Place of OriginShenzhen,China
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Marka adıONESEINE
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SertifikaISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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FiyatUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T, Western Union
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Supply Ability1000000000pcs/mon
2 Layer Black Soldermask PCB Board FR4 CEM-3 Material
CEM-3 High Density Interconnect HDI Flex PCB FR4 Circuit Board Multilayer
Product Specifications
| Attribute | Value |
|---|---|
| Product Name | 2 Layer Black Soldermask PCB Board |
| Material | FR-4, FR-4 High Tg, Polyimide |
| Color | Black |
| Tolerance Of PCB | ±5% |
| PCB Standard | IPC-A-610 D |
| BGA | 7mil |
| Special | Can be customized |
8Layer CEM-3 Material HDI High Density Interconnect FR4 PCB Circuit Board
PCB Parameters:
PCB material: CEM-3
Product name: automotive electronics PCB
Layer: 8
Surface finish: ENIG
Copper weight: 1OZ
Line width: 6mil
Thickness: 1.6mm
PCB material: CEM-3
Product name: automotive electronics PCB
Layer: 8
Surface finish: ENIG
Copper weight: 1OZ
Line width: 6mil
Thickness: 1.6mm
The Difference Between CEM-3 and FR-4
CEM-3 is a composite copper clad laminate that uses a combination of glass cloth and glass mat, while FR-4 uses only glass cloth. CEM-3 offers similar performance to FR-4 with advantages in drill bit wear rate, punching and press forming, and dimensional accuracy. Both materials meet the same standards for glass transition temperature, immersion resistance, peeling strength, and electrical properties.
Determining Characteristic Impedance in HDI PCB Design
Two primary methods exist for calculating characteristic impedance:
- Empirical Formulas: Provide approximate calculations using simplified assumptions, suitable for initial estimates.
- Field Solver Simulations: Offer precise results by considering specific layer stackup, trace geometry, and material properties, recommended for high-frequency applications.
HDI PCB Applications
- Mobile Devices: Smartphones, tablets with integrated processors and sensors
- Computing Equipment: Laptops, servers, networking devices
- Medical Devices: Diagnostic machines, patient monitoring systems
- Automotive Electronics: ADAS, infotainment systems
- Aerospace/Defense: Avionics, radar systems
- Industrial IoT: Automation, smart home devices
Challenges in Automotive HDI PCB Implementation
- Ensuring reliability under harsh environmental conditions
- Maintaining signal integrity with high-speed data transmission
- Effective thermal management for heat dissipation
- Complex manufacturing processes requiring specialized equipment
- Balancing cost with performance requirements
- Meeting strict automotive regulatory standards
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