Immersion Gold Microvia HDI Circuit Board 2oz Copper PCB OEM
Product Specifications
Attribute |
Value |
Product description |
HDI PCB Circuit Board Vendor From China |
Vendor |
PCB China |
Type |
HDI PCB Circuit Board |
Applications |
Industry |
Surface Finish |
Immersion gold |
Product Name |
prototype pcb for bga pcba |
Microvias |
1-2,10-16,12-16,14-16 |
System |
pneumatic type |
PCB Parameters
- Number of layers: 2
- Material: FR-4
- Board thickness: 1.6mm
- Surface treatment: Immersion gold
- Minimum aperture: 0.1mm
- Outer line width/line spacing: 4.5/4.5mil
- Inner line width/line spacing: 4/3.5mil
- Features: HDI circuit board
HDI PCB Design Guidelines
Ensuring Proper Stitching Vias or Ground Vias
- Determine Via Spacing and Distribution: Base spacing on signal frequency requirements and desired isolation level.
- Place Vias Along Signal Traces: Distribute evenly along traces for effective coupling with ground plane.
- Connect Vias to Solid Ground Plane: Ensure direct connection without interruptions for optimal return path.
- Use Sufficient Via Diameter and Aspect Ratio: Select appropriate size for conductivity and thermal dissipation.
- Avoid Via Stub Lengths: Minimize stubs to reduce impedance discontinuities and signal reflections.
- Consider Ground Via Arrays: Use multiple vias in grid patterns for enhanced isolation.
- Perform Signal Integrity Analysis: Conduct simulations to evaluate via effectiveness and adjust as needed.
Determining Transmission Line Characteristic Impedance
- Empirical Formulas: Use microstrip transmission line formula for approximate calculations.
- Field Solver Simulations: Employ specialized software (Ansys HFSS, CST Studio Suite) for precise impedance calculations in complex designs.
HDI PCB Applications
- Mobile Devices: Smartphones, tablets with integrated processors and sensors
- Computing and Networking: Servers, routers, data center equipment
- Medical Devices: Diagnostic machines, imaging systems, implantable devices
- Automotive Electronics: ADAS, infotainment systems, vehicle connectivity
- Aerospace and Defense: Avionics, satellites, radar systems
- Industrial and IoT: Automation systems, smart devices, environmental monitoring