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Vurgulamak
6oz fpga pcb design
,OSP fpga pcb design
,OSP hdi multilayer pcb
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Product name6 layer Medical Equipment pcb X-ray Inspection PCB Printed Circuit Board
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Product descriptionpcb x ray inspection service automated optical inspection pcb x-ray machine
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Copper Thickness0.5oz - 6oz
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Board CuttingShear, V-Score, Tab-Routed, Counter Sunk
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Min Hole Size0.1mm
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SurfaceOSP
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Number Of Layers6 layers
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File FormatsGerber Files;Pack-N-Place File(XYRS)
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Place of OriginShenzhen,China
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Marka adıONESEINE
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SertifikaISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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FiyatUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T,Western Union
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Supply Ability1000000000pcs/mon
6 Layer Medical X-Ray Inspection PCB with OSP Finish
6 Layer Medical Equipment X-Ray Inspection PCB
High-Quality FR4 PCB for Medical Applications
| Attribute | Specification |
|---|---|
| Product Name | 6 layer Medical Equipment PCB X-ray Inspection PCB |
| Copper Thickness | 0.5oz - 6oz |
| Board Cutting | Shear, V-Score, Tab-Routed, Counter Sunk |
| Min Hole Size | 0.1mm |
| Surface Finish | OSP |
| Number of Layers | 6 layers |
| File Formats | Gerber Files; Pack-N-Place File (XYRS) |
Product Specifications
Base Material: FR-4/HTG150-180 FR-4/CEM-1/CEM-3/Aluminum
Board Thickness: 1.6mm
Min. Line Width: 0.254mm
Min. Line Spacing: 3mil
Surface Finishing: HASL, Immersion Gold, OSP
Solder Mask: Double-sided Green LPI
Testing Service: X-Ray
Certificate: ISO 9001:2008/ISO
Board Thickness: 1.6mm
Min. Line Width: 0.254mm
Min. Line Spacing: 3mil
Surface Finishing: HASL, Immersion Gold, OSP
Solder Mask: Double-sided Green LPI
Testing Service: X-Ray
Certificate: ISO 9001:2008/ISO
Applications
- Medical equipment
- Communication industry
- Consumer electronics
- Automobile industry
Key Features
- Advanced R&D support and equipment for quality assurance
- Customer-focused approach to meet specific requirements
- High frequency telecom and high speed transmission capabilities
- Excellent thermal stress resistance (288°C, 10sec)
- Precise conductor width control (±0.02mm)
- Multiple thickness options available (0.5mm to 1.6mm)
FR4 Material Properties
Glass Transition Temperature (Tg): 150Tg or 170Tg
Decomposition Temperature (Td): > 345°C
Thermal Expansion (CTE): 2.5%-3.8%
Dielectric Constant (@1 GHz): 4.25-4.55
Dissipation Factor (@1 GHz): 0.016
UL Rating: 94V-0, CTI = 3 minimum
Decomposition Temperature (Td): > 345°C
Thermal Expansion (CTE): 2.5%-3.8%
Dielectric Constant (@1 GHz): 4.25-4.55
Dissipation Factor (@1 GHz): 0.016
UL Rating: 94V-0, CTI = 3 minimum
High Frequency PCB Requirements
- Stable dielectric constant (Dk)
- Low dielectric loss (Df) for minimal signal loss
- Matched thermal expansion coefficient with copper foil
- Low water absorption for consistent performance
- Excellent heat and chemical resistance
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