8 Layer EMI FR4 Circuit Board Prototype PCB
Product Specifications
Surface treatment:
Immersion gold
Outer line width/spacing:
4/4mil
Inner line width/spacing:
3.5/4.5mil
Product Attributes
Attribute |
Value |
Trade Terms |
EX-WORK, DDO TO DOOR, FOC |
Sold Mask Color |
green/black/white/red/blue/yellow |
Origin |
Shenzhen |
Application |
Medical Field, telecommunications |
PCB Design Optimization for Noise Reduction
- Separate Analog and Digital Sections: Physically isolate analog and digital components to reduce cross-talk and EMI
- Ground Plane Considerations: Use continuous ground planes with low-impedance return paths
- Signal Routing: Keep traces short, route perpendicularly, and use controlled impedance for high-speed signals
- Decoupling Capacitors: Place near IC power pins with appropriate values and low ESR
- Power Supply: Separate analog/digital power planes with proper filtering
- Shielding: Use ground planes, guard traces, and careful connector placement
- Thermal Management: Incorporate thermal vias and heat sinks for high-power components
Data Acquisition Card PCB Components
A data acquisition (DAQ) card PCB interfaces computers with external systems to measure and control physical quantities. Key components include:
- Analog-to-Digital Converter (ADC) for signal conversion
- Digital-to-Analog Converter (DAC) for output signals
- Multiplexer for multiple input channels
- Signal conditioning circuitry
- Microcontroller or FPGA for control
- Various connectors (BNC, screw terminals, D-Sub)
- Power supply circuitry