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ONESEINE TECHNOLOGY CO.,LTD 86-757-86226896 sales@oneseine.com
13 Layer Megtron6 5G PCB Board 2OZ Copper for Communication Systems

13 Layer Megtron6 5G PCB Board 2OZ Copper for Communication Systems

  • Vurgulamak

    communication Multilayer PCB Board

    ,

    2OZ Multilayer PCB Board

    ,

    2OZ multilayer printed circuit board

  • Port
    Shenzhan,Hongkong
  • Pcb
    High frequency PCB
  • Silkscreen Color
    White/Black/Yellow/Red
  • Legend
    White
  • Board Size
    200*150mm
  • Copper Thickness
    0.5oz-6oz
  • Min Line Width
    0.2mm
  • Testing Service
    100% AOI Testing/ICT/FCT test
  • Place of Origin
    Shenzhen,China
  • Marka adı
    ONESEINE
  • Sertifika
    ISO9001,ISO14001
  • Model Number
    ONE-102
  • Minimum Order Quantity
    1pcs
  • Fiyat
    USD0.1-1000
  • Packaging Details
    Vacuun bag
  • Delivery Time
    5-8 working days
  • Payment Terms
    T/T, Western Union
  • Supply Ability
    1000000000pcs/mon

13 Layer Megtron6 5G PCB Board 2OZ Copper for Communication Systems

Printed Circuit Multilayer PCB Board 2OZ Copper For Communication Systems
Product Specifications
Attribute Value
Port Shenzhan, Hongkong
PCB High frequency PCB
Silkscreen Color White/Black/Yellow/Red
Legend White
Board Size 200*150mm
Copper Thickness 0.5oz-6oz
Min Line Width 0.2mm
Testing Service 100% AOI Testing/ICT/FCT test
Product Description
13 Layer Millimeter Wave MMW Megtron6 5G PCB Manufacturer
PCB Parameters
  • Material: Panosonic megtron6
  • Copper: 2OZ
  • Thickness: 2mm
  • Board size: 18*20CM
  • Surface finish: ENIG
  • Solder mask: Green
  • Silk screen: White
Multilayer PCB Applications
Multilayer PCBs are essential components in various industries requiring complex circuitry, high density, and reliability:
  • Consumer Electronics: Smartphones, tablets, laptops, gaming consoles
  • Telecommunications: Routers, switches, modems, base stations
  • Automotive Electronics: Engine control, infotainment, ADAS systems
  • Industrial Equipment: Control systems, robotics, automation
  • Aerospace and Defense: Avionics, radar, communication equipment
  • Medical Devices: Diagnostic tools, imaging systems, monitoring devices
  • Power Electronics: Inverters, converters, motor drives
Multilayer PCB Production Process
Our manufacturing process ensures high-quality multilayer PCBs through precise execution of each stage:
  • Design and CAM processing
  • Material preparation and inner layer processing
  • Outer layer processing and multilayer lamination
  • Plating, surface finish application
  • Routing, V-Cut separation
  • Component assembly and soldering
  • Comprehensive testing and inspection
  • Secure packaging and shipping
Multilayer PCB Types
We manufacture various specialized PCB types to meet diverse application requirements:
  • Standard Multilayer PCB: 4-8 layer configurations
  • HDI PCB: High-density interconnects with microvias
  • Flex/Rigid-Flex PCB: Flexible circuit solutions
  • Sequential Lamination PCB: For complex, high-layer count designs
  • Metal Core PCB: Enhanced thermal management
  • RF/Microwave PCB: Optimized for high-frequency applications
Multilayer PCB Stack-Up
Our PCB stack-up configurations are carefully designed to ensure optimal electrical performance, signal integrity, and thermal characteristics:
  • Precision signal layers for optimal routing
  • Dedicated power and ground planes
  • High-quality prepreg insulation layers
  • Stable core layer for mechanical strength
  • Protected surface layers with soldermask
  • Clear silkscreen markings for assembly
13 Layer Megtron6 5G PCB Board 2OZ Copper for Communication Systems 0