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Custom Multilayer FR4 PCB Board with 50ohm 75ohm Impedance Control

Custom Multilayer FR4 PCB Board with 50ohm 75ohm Impedance Control

Ürünler - Çok katmanlı PCB kartı
  • Vurgulamak

    Industrial Control Multilayer PCB Board

    ,

    50ohm Multilayer PCB Board

    ,

    custom pcb design 75ohm

  • material
    fr4
  • layers
    multilayer
  • location
    China
  • Other
    High Density PCB
  • Product Type
    RGD ROHS PCB
  • Impedance Control
    50ohm, 75ohm, 100ohm, etc.
  • Min Hole
    0.2MM
  • Copper Thinknes
    1 oz
  • Place of Origin
    Shenzhen,China
  • Marka adı
    ONESEINE
  • Sertifika
    ISO9001,ISO14001
  • Model Number
    ONE-102
  • Minimum Order Quantity
    1pcs
  • Fiyat
    USD0.1-1000
  • Packaging Details
    Vacuun bag
  • Delivery Time
    5-8 working days
  • Payment Terms
    T/T, Western Union
  • Supply Ability
    1000000000pcs/mon

Custom Multilayer FR4 PCB Board with 50ohm 75ohm Impedance Control

Fiyat Al Şimdi başvurun
Custom Industrial Control Multilayer PCB Board Design 50ohm 75ohm Impedance Control
Product Specifications
Material FR4
Layers Multilayer
Location China
Type RGD ROHS PCB
Impedance Control 50ohm, 75ohm, 100ohm, etc.
Min Hole 0.2MM
Copper Thickness 1 oz
Product Description
Multilayer Fr4 14 Layer Industrial Control PCB Circuit Board
PCB Parameters
Layer: 14
Material: Fr4
Board thickness: 4.8mm
Surface finish: Immersion gold
Min hole: 4/4mil
Inner line width/gap: 4/4mil
Application: Industrial control circuit board
Multilayer PCB Types
  • Standard Multilayer PCB: Basic type with 4-8 layers for general electronic devices
  • High-Density Interconnect (HDI) PCB: Features microvias for compact devices like smartphones
  • Flex and Rigid-Flex PCB: Combines flexible and rigid sections for wearable and medical devices
  • Sequential Lamination PCB: For complex designs requiring 10+ layers
  • Metal Core PCB: Aluminum/copper core for superior heat dissipation in power electronics
  • RF/Microwave PCB: Specialized for high-frequency applications in wireless communications
Applications
  • Consumer Electronics: Smartphones, tablets, laptops, TVs
  • Telecommunications: Routers, switches, base stations
  • Automotive: Engine control, ADAS, infotainment systems
  • Industrial Equipment: Control systems, robotics, automation
  • Aerospace/Defense: Avionics, radar, satellite systems
  • Medical Devices: Diagnostic tools, imaging systems
  • Power Electronics: Inverters, converters, power supplies
Production Process
  1. Design and CAM processing
  2. Material preparation and inner layer processing
  3. Outer layer processing with soldermask application
  4. Multilayer lamination under heat and pressure
  5. Plating and surface finish application
  6. Routing and V-cut separation
  7. Component assembly and soldering
  8. Testing and quality inspection
  9. Packaging and shipping
PCB Stack-Up Configuration
Our multilayer PCBs feature optimized layer arrangements including:
  • Signal layers for electrical routing
  • Power and ground planes for stable references
  • Prepreg insulation layers
  • Core layer for mechanical stability
  • Surface layers for component connectivity
  • Soldermask and silkscreen layers for protection and identification
Stack-up designs are customized for each application to ensure optimal signal integrity, power distribution, and thermal management.
Custom Multilayer FR4 PCB Board with 50ohm 75ohm Impedance Control 0
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