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ENIG FR4 Multilayer PCB Fabrication 0.2mm-6.0mm Thickness

ENIG FR4 Multilayer PCB Fabrication 0.2mm-6.0mm Thickness

Ürünler - Çok katmanlı PCB kartı
  • Vurgulamak

    OEM fr4 tg150

    ,

    fr4 tg150 Fabrication

    ,

    OEM fr4 circuit board

  • Product Name
    Mix stack up pcb super thick pcb fabrication
  • Surface Finish
    Immersion gold(ENIG)
  • Other Keywords
    Integrated Circuit Board,pcb fabrication companies,quick turn pcb fabrication,circuit board fabrication,fabrication board,pcb fabrication services,pcb fab house,board fabrication,low cost pcb
  • Thickness
    0.2mm-6.0mm
  • Minimum Line Width/Spacing
    0.075mm/0.075mm
  • Legend
    White
  • Quote Needs
    PCB Gerber file
  • Certificates
    ISO9001, ISO14001, UL, RoHS, etc.
  • Place of Origin
    Shenzhen,China
  • Marka adı
    ONESEINE
  • Sertifika
    ISO9001,ISO14001
  • Model Number
    ONE-102
  • Minimum Order Quantity
    1pcs
  • Fiyat
    USD0.1-1000
  • Packaging Details
    Vacuun bag
  • Delivery Time
    5-8 working days
  • Payment Terms
    T/T, Western Union
  • Supply Ability
    1000000000pcs/mon

ENIG FR4 Multilayer PCB Fabrication 0.2mm-6.0mm Thickness

Fiyat Al Şimdi başvurun
OEM ENIG FR4 TG150 Circuit Board PCB Fabrication 0.2mm-6.0mm
Product Specifications
Attribute Value
Product Name Mix stack up pcb super thick pcb fabrication
Surface Finish Immersion gold (ENIG)
Thickness 0.2mm-6.0mm
Minimum Line Width/Spacing 0.075mm/0.075mm
Legend White
Quote Needs PCB Gerber file
Certificates ISO9001, ISO14001, UL, RoHS, etc.
Keywords
Integrated Circuit Board PCB fabrication companies Quick turn PCB fabrication Circuit board fabrication Fabrication board PCB fabrication services PCB fab house Board fabrication Low cost PCB
FR4 Super Thick Integrated Circuit Board PCB Fabrication Services
PCB Parameters
  • Material: FR4
  • Layer: 8
  • Surface finish: ENIG
  • Thickness: 5mm
Information Required for Quotation
  • PCB Gerber files (Protel, PowerPCB, AutoCAD, etc.)
  • BOM list for PCB assembly
  • Sample PCB or PCBA
Competitive Advantages
  • Certifications: UL, RoHS, ISO, IPC
  • Lead time: 3-10 working days
  • Competitive pricing with best quality
  • 20+ years experience in High Tg Multilayer PCB
Our Electroless Nickel TG180 8 layer PCB board with BGA (Ball Grid Array) structure offers reduced package size, increased pin count, self-centering during soldering, excellent electrical performance, high reliability, and low overall cost. BGA PCBs typically feature numerous holes, with most customers specifying finished hole diameters of 8-12mil and BGA surface spacing of at least 10.5mil (standard 31.5mil). All BGA vias require hole plugging, with no ink allowed on BGA pads and no drilling permitted on BGA pads.
Multilayer PCB Production Process
  1. Design: Schematic and layout creation using specialized PCB design software, including layer stack-up definition, trace routing, component placement, and signal integrity considerations.
  2. CAM Processing: Conversion of design data into manufacturing instructions (Gerber files, drill files, layer-specific information).
  3. Material Preparation: Cutting core material (typically FR-4 fiberglass epoxy) to panel sizes and preparing copper foil sheets.
  4. Inner Layer Processing:
    • Cleaning copper foil
    • Laminating copper to core material
    • Applying and exposing photoresist
    • Etching unwanted copper
    • Drilling precision holes
  5. Outer Layer Processing: Similar to inner layer processing with additional soldermask and silkscreen application.
  6. Multilayer Lamination: Stacking and bonding layers with prepreg material under heat and pressure.
  7. Plating and Surface Finish: Electroplating vias and applying protective surface finishes (tin, lead-free solder, or gold).
  8. Routing and V-Cut: Separating individual PCBs from panel.
  9. Assembly: Component placement and soldering.
  10. Testing and Inspection: AOI, functional testing, and quality checks.
  11. Packaging and Shipping: Final preparation for transportation.
Multilayer PCB Stack-Up
Our multilayer PCB stack-up configuration is carefully designed to optimize electrical performance, signal integrity, impedance control, and thermal characteristics. The standard arrangement includes:
  • Signal Layers: Copper traces for electrical signals, sandwiched between power/ground planes
  • Power and Ground Planes: Stable voltage references and return paths
  • Prepreg Layers: Insulating material between signal layers
  • Core Layer: Central FR-4 layer for mechanical stability
  • Surface Layers: Outermost layers for component connectivity
  • Soldermask and Silkscreen: Protective coating and component markings
Multilayer PCB Types
  • Standard Multilayer PCB: 4-8 layers for general electronics
  • HDI PCB: High density with microvias for compact devices
  • Flex/Rigid-Flex PCB: Flexible sections for wearable/medical devices
  • Sequential Lamination PCB: 10+ layers for complex designs
  • Metal Core PCB: Aluminum/copper core for heat dissipation
  • RF/Microwave PCB: Specialized for high-frequency applications
Applications
Our multilayer PCBs serve diverse industries including consumer electronics, telecommunications, automotive, industrial equipment, aerospace/defense, medical devices, power electronics, and industrial control systems.
ENIG FR4 Multilayer PCB Fabrication 0.2mm-6.0mm Thickness 0
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