6 Layer Rogers FR4 Ladder Filter PCB 1.2MM Thickness

Attribute	Value
Layer	6
Material	Rogers Fr4
Type	Ladder filter PCB
Thickness	1.2MM
SMT Efficiency	BGA, QFP, SOP, QFN, PLCC, CHIP
Silkscreen Color	White, Black, Yellow, Red, Blue, etc.
Product Type	RGD ROHS PCB
Reinforcement Material	Glass fiber cloth base

Rogers Fr4 6 Layer Mix Stack up Dielectric Circuit Board Ladder PCB is designed for high-frequency applications with superior signal integrity and thermal performance.

• Material: Rogers 4350 + FR4
• Thickness: 1.2MM
• Surface Finish: Gold
• Copper: 1OZ
• Type: Rogers FR4 MIX stack up ladder filter PCB

Oneseine Company specializes in high frequency microwave PCBs for applications including power dividers, combiners, power amplifiers, base stations, RF antennas, and 4G antennas. We maintain extensive stock of high-frequency PCB materials including Rogers, TACONIC, Arlon, Isola, F4B, TP-2, and FR-4 (dielectric range: 2.2-16) for communication devices, electronics, aerospace, and military industries.

Rogers 4350 materials provide tight control on dielectric constant and low loss while maintaining compatibility with standard epoxy/glass processing methods. Key benefits include:

• Lower dielectric loss
• Reduced signal loss
• Cost-effective circuit fabrication
• Ideal for fast-turnaround prototyping

• Cellular Base Station Antennas and Power Amplifiers
• Microwave point to point (P2P) links
• Automotive Radar and Sensors
• RF Identification (RFID) Tags
• LNB's for Direct Broadcast Satellites

Material	Dielectric Constant
RO4350B	3.48±0.05@10 GHz
RO4003C	3.38±@10 GHz
Ro3003	3.00±0.04@10 GHz
Ro3010	10.2±0.03@10 GHz
RT5880	2.20±0.02@10 GHz

Various multilayer PCB configurations serve different application requirements:

• Standard Multilayer PCB: 4-8 layers for general electronics
• HDI PCB: High density with microvias for compact devices
• Flex/Rigid-Flex PCB: Flexible sections for wearable and medical devices
• Sequential Lamination PCB: Complex designs with 10+ layers
• Metal Core PCB: Enhanced heat dissipation for power electronics
• RF/Microwave PCB: Specialized for high-frequency applications

Multilayer PCBs enable advanced functionality across multiple sectors:

• Consumer Electronics (smartphones, tablets, TVs)
• Telecommunications (routers, base stations)
• Automotive (ADAS, infotainment systems)
• Industrial (robotics, automation)
• Aerospace/Defense (avionics, radar)
• Medical (diagnostic equipment)
• Power Electronics (inverters, converters)

Our multilayer PCB manufacturing follows rigorous quality standards:

1. Design and CAM processing
2. Material preparation and inner layer processing
3. Outer layer processing and multilayer lamination
4. Plating and surface finish application
5. Routing, assembly, and comprehensive testing

Our 6-layer stack-up optimizes signal integrity and thermal performance:

• Signal layers for electrical routing
• Dedicated power and ground planes
• Prepreg insulation between layers
• Core layer for mechanical stability
• Surface layers with soldermask protection