6 Layer Multilayer Rogers 5880 FR4 PCB with ENIG Finish

Radio frequency (RF) and microwave PCBs operate in the megahertz to gigahertz frequency ranges, serving communication applications from cellphones to military radars. These advanced composite materials feature specific characteristics for dielectric constant (Er), loss tangent, and CTE (coefficient of thermal expansion).

High frequency circuit materials with low stable Er and loss tangent enable high-speed signal transmission with less impedance than standard FR-4 materials. These materials can be mixed in the same stack-up for optimal performance and cost-efficiency.

The low X, Y and Z CTE ensures PCB stability in high temperature environments while operating up to 40 GHz in analog applications, facilitating placement of fine pitch components and maintaining layer alignment in complex layouts.

• High assembly density with compact size and light weight
• Improved reliability through reduced component connections
• Enhanced design flexibility with multiple wiring layers
• Capable of forming circuits with specific impedance requirements
• Supports high-speed transmission circuits
• Allows integration of shielding and thermal management layers
• Simplified installation with high reliability

Note: Multilayer PCBs have higher costs and longer production cycles, requiring advanced reliability testing methods.

• Consumer Electronics: Smartphones, tablets, laptops, TVs
• Telecommunications: Routers, switches, base stations
• Automotive: Engine control, ADAS, infotainment
• Industrial: Control systems, robotics, automation
• Aerospace/Defense: Avionics, radar, satellite systems
• Medical: Diagnostic tools, imaging systems
• Power Electronics: Inverters, converters, power supplies

1. Design: Schematic creation and layout using specialized software
2. CAM Processing: Conversion to manufacturing instructions
3. Material Preparation: Core and copper foil preparation
4. Inner Layer Processing: Cleaning, lamination, imaging, etching
5. Outer Layer Processing: Similar to inner layer with additional finishing
6. Multilayer Lamination: Layer stacking and bonding
7. Plating and Surface Finish: Via plating and protective coatings
8. Routing and V-Cut: Panel separation
9. Assembly: Component placement and soldering
10. Testing: AOI, functional testing, quality verification

The stack-up arrangement determines electrical performance, signal integrity, and thermal characteristics:

• Signal Layers: Copper traces for electrical signals
• Power/Ground Planes: Stable voltage references and return paths
• Prepreg Layers: Insulating material between signal layers
• Core Layer: Central structural component
• Surface Layers: Outer connectivity layers
• Soldermask/Silkscreen: Protective and identification layers

Complex designs may incorporate additional specialized layers for controlled impedance or thermal management.