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Vurgulamak
High TG Multilayer PCB Board
,full turnkey Multilayer PCB Board
,bulk pcb prototype board
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layer16
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materialfr4
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Copper Thickness0.5-10 OZ
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PortShenzhen, Hongkong
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Base MaterialFR4/FR4 High TG/FR4 black core/...
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Min Annular Ring5mil
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Impedance ControlYes
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Solder Mask ColorGreen, Red, Blue, Black, White, Yellow, etc.
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Place of OriginShenzhen,China
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Marka adıONESEINE
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SertifikaISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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FiyatUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T, Western Union
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Supply Ability1000000000pcs/mon
16 Layer FR4 High TG Multilayer PCB with Impedance Control
Bulk FR4 High TG Prototype Multilayer PCB Board Full Turnkey Service
Product Specifications
| Attribute | Value |
|---|---|
| Layer | 16 |
| Material | FR4 |
| Copper Thickness | 0.5-10 OZ |
| Port | Shenzhen, Hongkong |
| Base Material | FR4/FR4 High TG/FR4 black core/... |
| Min Annular Ring | 5mil |
| Impedance Control | Yes |
| Solder Mask Color | Green, Red, Blue, Black, White, Yellow, etc. |
16 Layer FR4 PCB Multilayer Printed Circuit Board Prototype
PCB Basic Information:
- Layer: 16
- Name: Multilayer PCB printed circuit board
- Special: Buried blind vias
- Surface finish: Immersion gold
- Copper weight: 1OZ
- Solder mask: Blue
- BGA: Yes
PCB Files Requirements
We accept the following PCB file formats as compressed zipped folders with all necessary files included:
- Gerber files (274X format)
- ODB++ files
- .pcbdoc and .brd files (from PCB Creator software)
- All copper layers of the board
- Drill file
- Outline layer (may need to be exported separately)
- Top/bottom copper layers
- Inner layers (for multi-layer boards)
- Silkscreen layers (top/bottom)
- Solder mask layers (top/bottom)
- Border layer (defining board shape)
Multilayer PCB Manufacturing Capabilities
- Materials: FR4, Aluminum base, Copper base, Halogen Free material, Flexible PCB (FPC)
- Layer counts: 1-16 layers (Double-sided and Multilayer PCB)
- Finished Copper Thickness: 0.5-8 OZ
- Finished Board Thickness: 0.2-4.0mm
- Min. Line/Track Width: 3mil
- Min. Line/Track Space: 3mil
- Min. Contour Tolerance: ±0.1mm
- Min. Finished Diameter of PTH Hole: 0.1mm
- Max. Board Thickness/Hole Ratio: 12:1
- Min. Solder Mask Bridge: 4mil (Min. SMT Pad Space 8mil)
- Min. Legend/Silkscreen Track Width: 5mil
- Min. Legend/Silkscreen Height: 30mil
- Min. Drilling Slot Size: 0.6mm
- Solder Mask Colors: Green, Black, Blue, White, Yellow, Grey
- Silkscreen Colors: White, Yellow, Black
- Surface Treatments: HAL, Lead Free HAL, Immersion Gold, OSP, Immersion Tin, Immersion Silver
- Special Technologies: Gold Finger, Peelable Mask, Non-Across Blind/Buried Vias, Impedance Control, Rigid-Flex Boards
- Reliability Testing: Flying Probe Test, Fixture Test, Impedance Test, Solderability Test, Thermal Shock Test, Hole Resistance Test, Micro Metallographic Section Analysis
- Flammability Rating: 94V-0
Multilayer PCB Production Process
1. Design
Creating schematic and layout using PCB design software, defining layer stack-up, trace routing, component placement, and signal integrity considerations with design rules for manufacturability.
2. CAM Processing
Converting design data into manufacturing instructions including Gerber files, drill files, and layer-specific fabrication data.
3. Material Preparation
Cutting core material (typically FR-4 fiberglass epoxy) into panel sizes and preparing copper foil sheets in required thicknesses.
4. Inner Layer Processing
a. Cleaning: Removing contaminants from copper foil
b. Lamination: Bonding copper foil to core material
c. Imaging: Applying photoresist and exposing with inner layer artwork
d. Etching: Removing unwanted copper to create traces and pads
e. Drilling: Creating precision holes for vias and component mounting
5. Outer Layer Processing
Similar to inner layer processing with additional steps for soldermask and silkscreen application.
6. Multilayer Lamination
Stacking processed layers with prepreg material and bonding under heat and pressure to form solid multilayer structure.
7. Plating and Surface Finish
Electroplating vias with copper for layer connectivity and applying protective surface finish (tin, lead-free solder, or gold).
8. Routing and V-Cut
Separating individual PCBs from panel and creating perforation lines for easy separation after assembly.
9. Assembly
Placing and soldering electronic components onto the PCB using reflow or wave soldering processes.
10. Testing and Inspection
Conducting automated optical inspection (AOI), functional testing, and other quality assurance procedures.
11. Packaging and Shipping
Protective packaging for transportation to final destination.
Multilayer PCB Stack-Up Configuration
The stack-up configuration determines electrical performance, signal integrity, impedance control, and thermal characteristics:
- Signal Layers: Copper traces carrying electrical signals, sandwiched between power/ground planes
- Power/Ground Planes: Stable voltage references and return paths, reducing EMI and noise
- Prepreg Layers: Insulating material bonding adjacent signal layers
- Core Layer: Central insulating layer providing mechanical strength
- Surface Layers: Outermost layers for component connectivity
- Soldermask/Silkscreen: Protective coating and component markings
Multilayer PCB Types
- Standard Multilayer PCB: 4-8 layers for general electronics
- HDI PCB: High density with microvias for compact devices
- Flex/Rigid-Flex PCB: Flexible sections for wearable/medical devices
- Sequential Lamination PCB: 10+ layers for complex designs
- Metal Core PCB: Aluminum/copper core for heat dissipation
- RF/Microwave PCB: Specialized materials for high-frequency applications
Multilayer PCB Applications
- Consumer Electronics: Smartphones, tablets, laptops, TVs
- Telecommunications: Routers, switches, base stations
- Automotive: Engine control, ADAS, infotainment
- Industrial: Control systems, robotics, automation
- Aerospace/Defense: Avionics, radar, satellite systems
- Medical: Diagnostic tools, imaging systems
- Power Electronics: Inverters, converters, power supplies
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