Scalable SSDs 6 Layer FR-4 Multilayer PCB Board With Immersion Gold
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Vurgulamak
Scalable Multilayer PCB Board
,automation Multilayer PCB Board
,automation plc pcb
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YüzeyDaldırma altın
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Panel1
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MateryalFR-4
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ÖzelÖzelleştirilebilir
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ROHS uyumluEvet
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HDI PCB StandartlarıIPC-A-610 D
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Ticaret şartlarıEski İş, DDO Kapıya, FOC
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satılan maske rengiyeşil/siyah/beyaz/kırmızı/mavi/sarı
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KökenShenzhen
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BaşvuruTıbbi Alan, telekomünikasyon
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Place of OriginShenzhen,China
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Marka adıONESEINE
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SertifikaISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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FiyatUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T, Western Union
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Supply Ability1000000000pcs/mon
Scalable SSDs 6 Layer FR-4 Multilayer PCB Board With Immersion Gold
Scalable PLC Multilayer PCB Board Prototyping For Automation
Product Specifications
| Attribute | Value |
|---|---|
| Surface | Immersion gold |
| Panel | 1 |
| Material | FR-4 |
| Special | Can be customized |
| Rohs Compliant | Yes |
| HDI PCB Standards | IPC-A-610 D |
| Trade Terms | EX-WORK, DDO TO DOOR, FOC |
| Sold Mask Color | green/black/white/red/blue/yellow |
| Origin | Shenzhen |
| Application | Medical Field, telecommunications |
Six Layer PCB Board Material FR4 Solid-state Drive Circuit Board
Number of layers: 6
Material: FR-4
Plate thickness: 1.6mm
Surface treatment: immersion gold
Minimum aperture: 0.2mm
Outer line width/line spacing: 4/4mil
Inner line width/line spacing: 3.5/4.5mil
Application area: Solid State Drive
Material: FR-4
Plate thickness: 1.6mm
Surface treatment: immersion gold
Minimum aperture: 0.2mm
Outer line width/line spacing: 4/4mil
Inner line width/line spacing: 3.5/4.5mil
Application area: Solid State Drive
Thermal Management Design Considerations
- Component Placement and Spacing: Strategic placement of high-power components with adequate spacing to prevent hot spots
- Thermal Vias: Optimized via patterns with larger diameters (0.3-0.5mm) for improved thermal conductivity
- Ground and Power Plane Design: Maximized copper area with sufficient thickness (2-4 oz) for effective heat transfer
- Heatsink Integration: Design features for secure heatsink attachment with thermal interface materials
- Airflow Optimization: Strategic component placement and PCB cutouts to promote air circulation
- Thermal Simulation: CFD analysis to refine thermal management strategies and identify hot spots
6-Layer PCB Structure
Layer Configuration:
1. Top Copper Layer
2. Inner Layer 1 (Ground Plane)
3. Inner Layer 2 (Signal Routing)
4. Inner Layer 3 (Power Plane)
5. Inner Layer 4 (Signal Routing)
6. Bottom Copper Layer
1. Top Copper Layer
2. Inner Layer 1 (Ground Plane)
3. Inner Layer 2 (Signal Routing)
4. Inner Layer 3 (Power Plane)
5. Inner Layer 4 (Signal Routing)
6. Bottom Copper Layer
Key Advantages
- Improved power distribution and ground integrity
- Enhanced signal integrity for high-speed interfaces
- Compact, dense layout for small form factor SSDs
- Scalable design for different capacity and performance tiers
- Effective thermal management through optimized plane design
Thermal Management Through Power/Ground Planes
The multilayer design provides efficient thermal pathways through:
- Low-impedance power distribution minimizing voltage drops and heating
- Continuous ground planes acting as thermal sinks and heat spreaders
- Strategic thermal via placement under high-power components
- Effective heatsink integration through low-resistance thermal paths
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