FR4 High Tg 6-Layer Multilayer PCB with HASL Lead-Free Finish

• Material: Shengyi S1000-2
• Board thickness: 1.6+/-0.16mm
• Size: 219mm*157.3mm
• Minimum aperture: 0.25mm
• Minimum hole copper: 25um
• Copper thickness: 35um
• Minimum line width: 0.075mm
• Minimum line distance: 0.085mm
• Surface treatment: Immersion gold
• End product: automated production equipment

A multilayer PCB (Printed Circuit Board) is a type of circuit board that consists of multiple layers of conductive traces, insulating material, and vias. It is commonly used in electronic devices where high-density and complex circuitry is required.

In a multilayer PCB, the conductive traces are typically made of copper and are etched onto the layers of the board. The insulating material, usually referred to as the substrate or core, is made of materials like fiberglass-reinforced epoxy resin (FR-4). The layers of conductive traces and insulating material are stacked on top of each other and bonded together under heat and pressure.

The layers are interconnected using vias, which are small plated-through holes that allow electrical connections between different layers of the PCB. Vias can be either through-hole vias or blind/buried vias. Through-hole vias span all layers of the board, while blind vias connect an outer layer to one or more inner layers, and buried vias connect two or more inner layers without reaching the outer layers.

• Standard Multilayer PCB: Basic type with 4-8 layers, used in general electronic devices
• High-Density Interconnect (HDI) PCB: Features microvias for higher component density in compact devices
• Flex and Rigid-Flex PCB: Combines flexible and rigid sections for applications requiring bending
• Sequential Lamination PCB: Allows for 10+ layers through separate lamination groups
• Metal Core PCB: Features aluminum or copper core for superior heat dissipation
• RF/Microwave PCB: Specialized for high-frequency applications with minimal signal loss

Multilayer PCBs find application across various industries and electronic devices where complex circuitry, high density, and reliability are required:

• Consumer Electronics (smartphones, tablets, laptops)
• Telecommunications equipment (routers, switches, modems)
• Automotive electronics (engine control, infotainment systems)
• Industrial equipment (control systems, robotics)
• Aerospace and defense systems (avionics, radar)
• Medical devices (diagnostic tools, imaging systems)
• Power electronics (inverters, converters)