Through Hole BGA ESP32 Multilayer PCB Board Custom Printing
Product Specifications
Attribute |
Value |
Number of Layers |
10 |
Impedance Control |
Yes |
BGA PCB |
Yes |
Application |
Medical Field, Telecommunications |
Solder Mask Color |
Green, Red, Blue, Black, White, Yellow, etc. |
Min Annular Ring |
5mil |
10-Layer Impedance BGA ESP32 Multi Layer PCB Design Bare Board
PCB Parameters
- Material: ShengYi FR4 fiberglass board
- Number of layers: 10-layer
- Board thickness: 3.0mm
- Copper thickness: 1oz
- Surface treatment process: Immersion gold
- Solder mask character color: green and white
- Minimum line width/line spacing: 7.09/6.68mil
- The smallest hole: 0.5mm
- Technical features: with impedance
Precision 10-Layer ESP32 PCBs: China's Impedance-Controlled BGA Powerhouse for Industrial IoT Dominance
Engineered to overcome critical barriers in industrial IoT device development, our 10-layer impedance-controlled PCBs deliver superior performance for ESP32 applications.
Key Advantages
- BGA Breakout Mastery: Supports 324-ball ESP32-S3/WROOM with 0.08mm microvias and via-in-pad plating
- Mixed-Signal Isolation: Split ground planes and shielded cavities provide 40dB isolation for 2.4GHz antennas
- Thermal Supremacy: Copper-filled vias reduce θJA by 60% and support 240MHz operation
- Manufacturing Precision: LDI exposure with 25μm trace accuracy and 100% impedance validation
- Reliability: Validated through 500 thermal cycles and 72hrs HAST testing
Certified Applications
- Industry 4.0 Gateways: 32°C cooler than 6-layer designs
- Medical Wearables: Passes IEC 60601-2-47 leakage tests
- Robotics Control: Achieves 0.3μs interrupt latency
China's Competitive Edge
- 7-Day Prototypes with impedance reports
- 40% cost savings vs. U.S./EU fabs
- Free ESP32 reference designs and signal integrity simulations
