6 Layer Gold Finger FR4 Multilayer Printed Circuit Board Manufacturing PCB service
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Vurgulamak
Goldfinger multilayer printed circuit board
,multilayer printed circuit board manufacturing
,Goldfinger pcb manufacturing service
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RenkSiyah
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MalzemeFR4
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Katmanlar6
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Yüzey kaplamasıAltın parmak
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Maksimum PCB boyutu1500*800 mm
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HDI PCB StandartlarıIPC-A-610 D
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katman numarası1-60
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Minimum Satır Genişliği4 milyon
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Place of OriginShenzhen,China
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Marka adıONESEINE
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SertifikaISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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FiyatUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T, Western Union
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Supply Ability1000000000pcs/mon
6 Layer Gold Finger FR4 Multilayer Printed Circuit Board Manufacturing PCB service
Goldfinger FR4 Multilayer Printed Circuit Board PCB Manufacturing Service
| Attribute | Value |
|---|---|
| Color | Black |
| Material | Fr4 |
| Layers | 6 |
| Surface Finish | Gold Finger |
| Max PCB Size | 1500*800mm |
| HDI PCB Standards | IPC-A-610 D |
| Layer Number | 1-60 |
| Min Line Width | 4mil |
6 Layer Gold Finger Fr4 Multilayer DIY Board Black PCB Maker
Gold Finger PCB Sample Specifications
Material: Fr4
Layer: 6
Board thickness: 1.18mm
Surface finish: immersion gold
Copper weight: 0.5OZ
Solder mask: Black
Silkscreen: White
Special features: BGA+Gold finger, 0.12mm laser hole
Certification: UL, ISO 9001, ISO 14001
Layer: 6
Board thickness: 1.18mm
Surface finish: immersion gold
Copper weight: 0.5OZ
Solder mask: Black
Silkscreen: White
Special features: BGA+Gold finger, 0.12mm laser hole
Certification: UL, ISO 9001, ISO 14001
| Min line width | 5mil | Min line space | 5mil |
| Min hole | 0.12mm | BGA | filled |
| Sample time | 7 days | Gerber file | Required |
Gold Finger Concept
Gold Finger refers to the gold-plated terminal of a card-edge connector, typically used for inserting the PCB into another installation as a connection. These are commonly produced as "PCB gold finger chamfer" with standard angles of 30 or 40 degrees. In prototype PCB production, gold fingers may be produced without chamfer unless specifically requested.
Gold fingers serve as connection points in computer hardware (between memory and memory slots, graphics cards and their slots, etc.), transmitting all signals through the gold-plated conductive contacts. The name derives from their finger-like arrangement and gold plating. The gold plating provides excellent oxidation resistance and conductivity.
Cleaning Gold Finger Oxide Layers
With prolonged use, computer components may accumulate dust and develop oxide layers on gold fingers, potentially causing connection issues. Effective cleaning methods include:
- Rubber erasers (standard pencil erasers)
- Pencils (the carbon composition provides conductive properties)
- Cotton swabs with anhydrous alcohol (ensure complete drying before use)
Multilayer PCB Stack-Up
The stack-up configuration determines the electrical performance, signal integrity, impedance control, and thermal characteristics of multilayer PCBs. A typical stack-up includes:
- Signal Layers: Copper traces for electrical signals
- Power/Ground Planes: Provide stable voltage references and return paths
- Prepreg Layers: Insulating material between signal layers
- Core Layer: Central structural layer providing mechanical stability
- Surface Layers: Outer layers for component connections
- Soldermask/Silkscreen: Protective coating and component markings
Multilayer PCB Types
Various multilayer PCB types serve different applications:
- Standard Multilayer: 4-8 layers for general electronics
- HDI PCBs: High density with microvias for compact devices
- Flex/Rigid-Flex: Flexible sections for wearable/medical devices
- Sequential Lamination: For complex designs with 10+ layers
- Metal Core: Enhanced heat dissipation for power electronics
- RF/Microwave: Specialized for high-frequency applications
Multilayer PCB Applications
Multilayer PCBs are essential in:
- Consumer electronics (smartphones, tablets, TVs)
- Telecommunications infrastructure
- Automotive control systems
- Industrial automation equipment
- Aerospace and defense systems
- Medical diagnostic equipment
- Power electronics and energy systems
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