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ONESEINE TECHNOLOGY CO.,LTD 86-757-86226896 sales@oneseine.com
4 Layer Heavy Copper PCB FR4 for Aerospace Telecommunications

4 Layer Heavy Copper PCB FR4 for Aerospace Telecommunications

  • Vurgulamak

    4 Layer heavy copper pcb

    ,

    Aerospace heavy copper pcb

    ,

    industrial pcb smt assembly

  • product_type
    PCB
  • layers
    4
  • material
    FR4
  • features
    Customized Mini Pad
  • Trade Term
    EX-WORK, DDO TO DOOR, FOC, FOB
  • Specialized In
    High-precision
  • Copper Thickness
    0.5OZ / 1 Oz / 2Oz or Custom
  • Application
    Telecommunications,Aerospace,Military
  • Place of Origin
    Shenzhen,China
  • Marka adı
    ONESEINE
  • Sertifika
    ISO9001,ISO14001
  • Model Number
    ONE-102
  • Minimum Order Quantity
    1pcs
  • Fiyat
    USD0.1-1000
  • Packaging Details
    Vacuun bag
  • Delivery Time
    5-8 working days
  • Payment Terms
    T/T, Western Union
  • Supply Ability
    1000000000pcs/mon

4 Layer Heavy Copper PCB FR4 for Aerospace Telecommunications

Industrial 4 Layer Heavy Copper PCB SMT Assembly For Aerospace
Attribute Value
Product Type PCB
Layers 4
Material FR4
Features Customized Mini Pad
Trade Term EX-WORK, DDO TO DOOR, FOC, FOB
Specialized In High-precision
Copper Thickness 0.5OZ / 1 Oz / 2Oz or Custom
Application Telecommunications, Aerospace, Military
4 Layer Customized Mini Pad Multi Layer Circuit Board PCB Maker
Basic Specifications
  • Name: Multilayer printed circuit boards
  • Layer: 4
  • Material: FR4
  • Thickness: 1.0mm
  • Copper weight: 2OZ
  • Surface finish: ENIG
  • Board size: 15*8CM
  • Panel: 2*1
  • Solder mask: Green
  • Silk screen: White
Multilayer PCB Manufacturing

Our highly trained PCB assembly technicians utilize state-of-the-art multilayer circuit board fabrication equipment to ensure that the finished boards meet your exacting standards and technical specifications. We offer same-day turn on two-layer PCBs and 24-hour turn on multilayer circuit boards without compromising quality.

Multi-layer Circuit Board Technology

Multi-layer circuit boards are fabricated by stacking two or more circuits with reliable pre-set interconnections. The production process involves creating each layer separately, then bonding them together through optical alignment and pressure. This technology allows for complex circuitry in compact designs, with layer counts ranging from 2 to over 30 in high-end applications.

Multilayer PCB Production Process
  • Design: Schematic creation and layout using specialized PCB design software
  • CAM Processing: Conversion of design data into manufacturing instructions
  • Material Preparation: Cutting core material and copper foil to required specifications
  • Inner Layer Processing: Cleaning, lamination, imaging, etching, and drilling
  • Outer Layer Processing: Similar to inner layer with additional soldermask application
  • Multilayer Lamination: Bonding layers under heat and pressure
  • Plating and Surface Finish: Electroplating vias and applying protective coatings
  • Routing and V-Cut: Separating individual PCBs from panels
  • Assembly: Component placement and soldering
  • Testing and Inspection: Quality verification through AOI and functional testing
Multilayer PCB Stack-up Configuration

Our multilayer PCBs feature optimized layer arrangements including signal layers, power/ground planes, prepreg insulation, and core material. The stack-up is carefully designed to ensure signal integrity, power distribution, thermal management, and manufacturability for your specific application requirements.

Industry Applications

Our 4-layer heavy copper PCBs are ideal for demanding applications in:

  • Aerospace and defense systems
  • Telecommunications infrastructure
  • Military electronics
  • High-reliability industrial equipment
  • Medical devices
  • Power electronics
4 Layer Heavy Copper PCB FR4 for Aerospace Telecommunications 0