High Frequency PCB High TG Copper Clad FR4 Board Fabrication
Product Specifications
Attribute |
Value |
Brand |
ENIG |
Material |
Rogers 3003+fr4 |
Thickness |
1.0mm |
Solder Mask Color |
Green, Blue, White, Black, etc. |
Type |
Industrial control |
Silkscreen |
White, Black, Yellow, Red, Blue, etc. |
Insulation Thickness |
Conventional board |
Insulating Resin |
Epoxy (EP) |
High Frequency Multilayer PCB Board
Basic Specifications:
- Name: Multilayer PCB printed circuit boards
- Material: Rogers 3003+fr4
- Layer: 6
- Thickness: 1.0mm
- Surface finish: ENIG
- Copper weight: 1OZ
- Application: Communication
- Min line and width: 4mil
Fabrication Process
- Cut raw material
- Inner layer dry film
- Black oxidation
- Stack up (pressing)
- Machine drilling
- Chemically deposited with copper
- Dry film and pattern plating
- Wet film solder mask
- Silk screen printing
- Profiling
- E-Test
- Final inspection
- Package
Alternating layers of prepeg and core materials are laminated together under high temperature and pressure to produce Multilayer PCBs. This process ensures that air isn't trapped between layers, conductors are completely encapsulated by resin, and the adhesive that holds the layers together are properly melted and cured.
Multilayer PCB Technology
Multilayer PCB is a circuit board that has more than two layers. Unlike a Double-Sided PCB which only has two conductive layers of material, all multilayer PCBs must have at least three layers of conductive material which are buried in the center of the material.
Applications
While the weight and space benefits of multilayer PCBs are especially valuable for Aerospace PCBs, multilayer PCBs are also beneficial to applications where "cross-talk" levels are critical:
- Computers
- File servers
- Data storage
- Signal transmission
- Cell phone transmission
- GPS technology
- Industrial controls
- Medical equipment
- Satellite systems
- Test equipment
- Nuclear detection systems