Custom Multilayer PCB Fabrication 6 Layer Immersion Gold

• Size: 11*7CM
• Layer: 6
• Surface finish: Immersion gold
• Thickness: 1.6mm
• Copper weight: 1.5OZ outer
• Color: Blue solder mask

• Rigid PCB: Single-sided, double-sided & multi-layer PCB (up to 30 layers) including HDI, High TG Multilayer, Heavy Copper, Gold Finger, Blind Buried Holes PCB, Impedance PCB and other special processes
• Flexible & Rigid-flex PCB: Flexible PCB (up to 10 layers) & Rigid-flex PCB (up to 8 layers)
• Metal Core PCB: Single/Double-Sided Aluminium Base PCB and Copper Base PCB
• PCB Material: CEM-1, CEM-3, FR-4, High TG, Polyimide, Aluminum and Copper-based material
• PCB Surface Technics: HAL, HAL lead free, Immersion Gold/Silver/Tin, Hard Gold, OSP

The manufacturing process begins with inner layer patterning, followed by printing and etching to form single or double-sided substrates. These are then incorporated into specified interlayers, heated, pressurized, and bonded before drilling. Plated through holes are created with copper layers to enable interlayer circuit conduction.

The outer line production involves secondary copper application and tin-lead plating as an etching resist. Anti-welding edge paint is applied as an insulating resin layer to protect circuits from oxidation and short circuits, with final high-temperature baking to harden the resin.

The stack-up configuration determines electrical performance, signal integrity, impedance control, and thermal characteristics. A typical multilayer PCB includes:

• Signal Layers: Copper traces for electrical signals, sandwiched between power and ground planes
• Power and Ground Planes: Provide stable reference and distribute power throughout the PCB
• Prepreg Layers: Insulating material between signal layers, typically FR-4
• Core Layer: Central layer providing mechanical strength and stability
• Surface Layers: Outermost layers for external component connectivity
• Soldermask and Silkscreen Layers: Protection and component markings

• Standard Multilayer PCB: 4-8 layers for general electronic devices
• HDI PCB: Higher density with microvias for compact devices
• Flex and Rigid-Flex PCB: Combines flexible and rigid sections
• Sequential Lamination PCB: For complex designs requiring 10+ layers
• Metal Core PCB: Aluminum or copper core for heat dissipation
• RF/Microwave PCB: Specialized for high-frequency applications

Multilayer PCBs are essential in industries requiring complex circuitry and high reliability:

• Consumer electronics (smartphones, tablets, laptops)
• Telecommunications equipment
• Automotive electronics and control systems
• Industrial equipment and automation
• Aerospace, defense, and avionics
• Medical devices and diagnostic equipment
• Power electronics and energy systems