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High Frequency 2 Layer Communication PCB 1OZ 35um

High Frequency 2 Layer Communication PCB 1OZ 35um

Ürünler - HF PCB
  • Vurgulamak

    35um HF PCB

    ,

    small batch HF PCB

    ,

    1OZ batch pcb

  • product_type
    Communication PCB
  • material
    High Frequency
  • layer_count
    2 layer
  • copper_weight
    1OZ
  • Min Line Width
    4mil
  • Mechanical Rigid
    Rigid
  • Feature
    Batch Customized Production
  • Copper Weight
    35um
  • Place of Origin
    Shenzhen,China
  • Marka adı
    ONESEINE
  • Sertifika
    ISO9001,ISO14001
  • Model Number
    ONE-102
  • Minimum Order Quantity
    1pcs
  • Fiyat
    USD0.1-1000
  • Packaging Details
    Vacuun bag
  • Delivery Time
    5-8 working days
  • Payment Terms
    T/T,Western Union
  • Supply Ability
    1000000000pcs/mon

High Frequency 2 Layer Communication PCB 1OZ 35um

Fiyat Al Şimdi başvurun
Communication HF PCB Circuit Board 1OZ 4mil 35um Small Batch Production
Product Specifications
Attribute Value
Product Type Communication PCB
Material High Frequency
Layer Count 2 layer
Copper Weight 1OZ
Min Line Width 4mil
Mechanical Rigid Rigid
Feature Batch Customized Production
Copper Weight 35um
PCB Technical Details
  • Application Products: Power Amplifier
  • Number of layers: 2
  • Surface treatment: OSP
  • Material: PTFE F4B
  • PCB size: 180*50mm
  • Outer line width/line spacing: 7/7mil
  • Inner line width/line spacing: 5/5mil
  • Board thickness: 2.3mm
  • Minimum aperture: 0.6mm
Precision High-Frequency PCBs for Mission-Critical Communication Systems

Engineered for demanding signal integrity in 5G, RF, and satellite applications, our high-frequency PCBs deliver GHz+ performance with exceptional reliability.

Why Our PCBs Dominate Critical Communication Hardware
  • Ultra-Low Signal Loss: Rogers/Taconic laminates with Dk=2.0-10.6 & controlled ±1.5% impedance tolerance
  • 1OZ Heavy-Copper Advantage: Enhanced current handling + thermal management for power amplifiers and base stations
  • Strict Handling Protocols: ESD-controlled environment | Vacuum-sealed packaging | Moisture-sensitive component (MSD) compliance
  • High-Frequency Expertise: 40+ layer builds | PTFE substrates | Laser-drilled microvias down to 0.1mm
  • Rigorous Testing: TDR analysis | Insertion loss measurements | Time-domain reflectometry
Applications We Enable
5G NR mmWave Antenna Arrays Satellite Communication Terminals Radar and Avionics Systems High-Speed Backplane Interconnects IoT Gateway RF Modules
Certified Reliability

ITAR Registered | ISO 9001:2015 | IPC-6012 Class 3 | RoHS 3.0 Compliant

High-Frequency PCB Design Considerations

Via Design: Vias can impact signal integrity at high frequencies. Our PCBs use techniques like back drilling or buried vias to minimize signal reflections and maintain signal integrity across layers.

Component Placement: Careful consideration is given to component placement to minimize signal path lengths, reduce parasitic capacitance and inductance, and optimize signal flow.

Shielding: To minimize electromagnetic interference (EMI) and RF leakage, our PCBs employ shielding techniques such as copper pours, ground planes, or metal shielding cans.

Industry Applications

Our high-frequency PCBs serve critical applications in wireless communication systems, aerospace, radar systems, satellite communication, medical devices, and high-speed data transmission.

High Frequency 2 Layer Communication PCB 1OZ 35um 0 High Frequency 2 Layer Communication PCB 1OZ 35um 1
Etiketler:

Rogers PCB üretimi

Yeşil maske PCB

Mikrodalga fırın PCB kartı

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