Rigid F4B High Frequency Rogers Circuit Board PTFE PCB For Communication Oscillator
Product Specifications
Attribute |
Value |
Material |
PTFE |
PCB Type |
F4B |
Thickness |
1.6mm |
Copper Thickness |
1OZ |
Surface Finish |
ENIG |
Size |
18*5cm |
Board Thickness |
1.6mm |
Silkscreen Color |
NA |
Technical Specifications
Technology: Multilayer PCBs with 18 layers | F4B
PCB Thickness: 1.6 mm | Final copper 1OZ
Conductor Track Widths: ≥ 90 µm | Minimum drilling diameter 0.2 mm
Contour Production: Milling/Scoring
Solder Masks: Photosensitive solder mask systems, UV solder mask system, screen printing
Surfaces: Immersion gold
Additional Printing: Identification printing, inkjet component printing, screen printing, through-hole printing, peelable solder mask (green mask), masking tape plugging
PTFE F4B: The Oscillator Stability Secret Powering Next-Gen Communications
The Frequency Control Crisis: In 5G base stations, satellite transponders, and radar systems, oscillator stability determines system performance. A mere 5 ppm frequency drift can disrupt millimeter-wave synchronization, causing dropped connections in dense urban 5G or radar false positives in defense systems.
While standard FR-4 PCBs introduce ±50 ppm/°C thermal drift, PTFE F4B circuit boards deliver game-changing stability:
- Near-zero thermal shift: CTE of 12 ppm/°C (X/Y axis)
- Ultra-low loss: Df=0.0004 @ 10GHz (1/8th of Rogers 4350B)
- Dielectric consistency: εr=2.55±0.04 (-50°C to +150°C)
- Hermetic immunity: 0% moisture absorption
Why Global Comm Giants Specify F4B for Oscillators
- Phase Noise Domination: F4B's virgin PTFE construction eliminates filler-induced dispersion with Q-factor >5,000 at 10GHz vs. 1,200 in ceramic-filled laminates, enabling 30% lower phase noise in 25GHz VCXOs.
- Thermal Compensation Mastery: Hybrid F4B-aluminum designs neutralize 98% of thermal expansion mismatch, reducing oscillator frequency drift to <±0.5 ppm/°C.
- EMI Shielding Integration: Copper-invar-copper (CIC) cores embedded in F4B stackups deliver 120dB RF isolation at 40GHz.
Advanced Manufacturing Processes
- Teflon®-specific plasma treatment: 12-stage surface activation
- Cryogenic machining: -196°C laser ablation eliminates PTFE "gumming"
- Vacuum lamination: 0.2% void content at 50 PSI
Surface Finish Options
- ENEPIG: 0.05μm gold over 0.15μm Pd/Ni, 500+ wire bond cycles at 25μm pitch
- Direct Gold Plating: 99.99% purity >0.5μm thickness, contact resistance <0.8mΩ
Mission-Critical Applications
- 5G Massive MIMO Radios: 64TRX AAUs with integrated 3.6GHz DCOs, 0.003 dB insertion loss/mm at 28GHz
- Satellite Communication Oscillators: Radiation-hardened OCXOs for GEO payloads with PIM <-170dBc @ 2×20W
- Electronic Warfare Systems: Agile frequency synthesizers (2-18GHz) with 5µs frequency hopping latency
Reliability Validation Protocol
- 1,000 extreme thermal cycles (-55°C ↔ +125°C)
- 85°C/85% RH for 1,000 hours with 100V bias
- 20G random vibration per MIL-STD-810H
- Helium leak rate <5×10⁻⁸ atm*cc/sec
Results: 0 field failures in 120,000+ F4B oscillator boards since 2021
Oscillator Stability Certification
Every F4B board includes comprehensive documentation:
- Phase Noise Report: -145dBc/Hz @ 10kHz offset (10GHz carrier)
- TDR Impedance Map: ±1.5% tolerance across panel
- S-parameters: Full 2-port data to 40GHz
- Material Certs: UL 94V-0, RoHS 3, REACH SVHC
Why China's F4B Specialists Dominate
- Speed-to-Market: 5-day prototypes with phase noise validation, 15-day volume production
- Cost Innovation: 30% lower cost vs. U.S. PTFE fabs with 96% panel utilization
- Technical Partnership: Free oscillator layout optimization and ANSYS HFSS stability simulations
"Our 38GHz backhaul radios achieved carrier-grade stability using F4B PCBs - reducing phase noise by 8dB while cutting oscillator costs by 40%. China's process mastery solved thermal drift issues that plagued our German-made boards."
- CTO, Top-5 Telecom Infrastructure Supplier