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Vurgulamak
Taconic 1000w amplifier pcb board
,ODM 1000w amplifier pcb board
,RF-35TC 100w amplifier pcb
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Product TypeHigh frequency PCB
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BrandTaconic
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MaterialRF-35TC
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ApplicationPower Amplifier
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CategoryPrinted Circuit Boards
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Surface FinishENIG
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Test100% Electrical Test Prior Shipment
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Pcb StandardIPC-II standard/IPC-III standard
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Place of OriginShenzhen,China
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Marka adıONESEINE
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SertifikaISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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FiyatUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T,Western Union
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Supply Ability1000000000pcs/mon
Taconic RF-35TC ENIG High Frequency PCB for Power Amplifiers
ODM ENIG 1000W Amplifier PCB Board Taconic RF-35TC for Power Amplifier
Product Specifications
| Attribute | Value |
|---|---|
| Product Type | High frequency PCB |
| Brand | Taconic |
| Material | RF-35TC |
| Application | Power Amplifier |
| Category | Printed Circuit Boards |
| Surface Finish | ENIG |
| Test | 100% Electrical Test Prior Shipment |
| Pcb Standard | IPC-II standard/IPC-III standard |
Taconic RF-35TC PCB Boards Specification
- Number of layer: 2
- Board size: 22*2.2cm
- Color: Black solder mask
- Craft edge: yes
- Surface finish: OSP
- Material: Taconic RF-35
- Gerber file: required
Outgoing reports include final inspection, solderability test, micro section test, thermal stresses test and more. Special technology includes pre bonded board.
Power Amplifier Revolution: Taconic RF-35TC PCBs
Engineered specifically for high-power RF amplifiers with its revolutionary ceramic-filled construction:
- Thermal Conductivity: 0.70 W/mK (3× FR-4)
- Z-axis CTE: 17 ppm/°C (matches copper)
- Dielectric Stability: εr=3.50±0.05 from -55°C to +150°C
- Loss Tangent: 0.0018 @ 10GHz
Why Tier-1 OEMs Specify RF-35TC for Power Amplifiers
- Thermal Runaway Prevention: Dissipates heat 60% faster than standard RF-35, reduces junction temperatures by 18°C
- Phase-Stable Amplification: ±0.3° phase stability under 50W/mm² power density
- Manufacturing Resilience: Survives 5× lead-free reflow cycles at 260°C, withstands 500 thermal shocks
Precision Manufacturing: China's RF-35TC Fabrication Edge
Leading Chinese manufacturers deploy specialized RF-35TC protocols including Direct Laser Imaging (25μm line resolution), Plasma Desmear (100% via void elimination), and Automated Optical Shaping.
Real-World Applications
- 5G mMIMO Power Amplifiers: 64T64R AAU designs with integrated 3.5GHz PAs
- Military Radar Modules: X-band (8-12GHz) T/R modules at 250W peak power
- Satellite Uplink Systems: Ka-band (26-40GHz) SSPAs with 70dB gain
Reliability Validation Protocol
China's top fabs subject RF-35TC boards to rigorous testing including thermal stress (1,000 cycles), humidity bias (85°C/85% RH for 168hrs), vibration resistance (20G RMS), and high-power cycling (10^6 cycles at 80% rated power).
Why Choose China's RF-35TC Specialists?
- Speed-to-Market: 10-day prototypes with TDR/S-parameter reports
- Cost Innovation: Hybrid RF-35TC/FR-4 stackups deliver 22% material savings
- Technical Partnership: Free HFSS thermal simulations and DfM analysis
"Switching to RF-35TC slashed our 5G PA thermal derating by 40% and cut amplifier failures by 18× in field deployments. China's manufacturing precision delivered consistent εr stability we couldn't achieve elsewhere."
- RF Engineering Director, Top-3 Base Station OEM
- RF Engineering Director, Top-3 Base Station OEM
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