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Vurgulamak
F4Bm255 pcb hf
,6mil pcb hf
,f4b pcb Fabrication
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materialF4Bm255
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layer2
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descriptionChinese substrate F4b 2Layer High Frequency PCB Printed Circuit Boards
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Min. Line Width/Spacing6mil/6mil
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Surface FinishHASL, ENIG, OSP, Immersion Silver, Immersion Tin, Immersion Gold, etc.
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TypeRigid Circuit Board
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Pcb NameDouble sided HF Prined Circuit Board
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Application AreaCommunication
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Place of OriginShenzhen,China
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Marka adıONESEINE
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SertifikaISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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FiyatUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T,Western Union
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Supply Ability1000000000pcs/mon
F4Bm255 HF PCB 2Layer 6mil Circuit Board for Communication
6mil Substrate PCB HF F4Bm255 Material Printed Circuit Board Fabrication
Product Specifications
| Attribute | Value |
|---|---|
| Material | F4Bm255 |
| Layer | 2 |
| Min. Line Width/Spacing | 6mil/6mil |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Immersion Gold, etc. |
| Type | Rigid Circuit Board |
| PCB Name | Double sided HF Printed Circuit Board |
| Application Area | Communication |
Product Description
Chinese substrate F4b 2Layer HIGH FREQUENCY PCB printed circuit boards Fabrication
PCB Information
- Material: F4Bm255 Chinese high frequency material
- Surface finish: OSP
- Copper weight: 2OZ
- Color: Black
- Size: 5*5 CM Circle
- Thickness: 1.6MM
Key Characteristics of High-Frequency Substrate Materials
- The dielectric constant (Dk) must be small and stable for optimal signal transmission
- Dielectric loss (Df) must be minimal to ensure high signal quality
- Copper foil thermal expansion coefficient should match the substrate material
- Low water absorption to maintain stable dielectric properties
- Excellent heat resistance, chemical resistance, impact strength, and peel strength
High-frequency applications typically operate above 1GHz. Current high-frequency PCB substrates include fluoropolymer-based materials (PTFE) for frequencies above 5GHz, and FR-4 or PPO substrates for 1GHz-10GHz applications.
The three primary high-frequency substrate materials are epoxy resin (most economical), PPO resin, and fluoropolymer resin (highest performance). Fluoropolymer substrates offer superior dielectric properties but require special copper foil treatment due to their molecular inertness.
Advanced fluoropolymer PCB development requires collaboration between material suppliers, research institutions, equipment manufacturers, and PCB producers to meet the evolving demands of high-frequency circuit applications.
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