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Vurgulamak
Arlon HF PCB
,TC350 HF PCB
,RF rogers tc350
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BrandArlon
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ModelTC350
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ApplicationMicrowave Radio RF PCB
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Thickness0.8mm
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Surface FinishImmersion Gold
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Thickness Tolerance( t≥0.8mm) ± 8% ±5%
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Pcb TypeRogers high frequency circuit board
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Solder Mask ColorGreen, Blue, Black, White
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Place of OriginShenzhen,China
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Marka adıONESEINE
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SertifikaISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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FiyatUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T,Western Union
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Supply Ability1000000000pcs/mon
Arlon TC350 Microwave Radio RF PCB Board 0.8mm Immersion Gold
Prototyping Microwave Radio RF HF PCB Boards 0.8mm Arlon TC350
Product Specifications
| Attribute | Value |
|---|---|
| Brand | Arlon |
| Model | TC350 |
| Application | Microwave Radio RF PCB |
| Thickness | 0.8mm |
| Surface Finish | Immersion Gold |
| Thickness Tolerance | ( t≥0.8mm) ± 8% ±5% |
| Pcb Type | Rogers high frequency circuit board |
| Solder Mask Color | Green, Blue, Black, White |
High-Performance RF PCB Solution
Arlon TC350 Microwave Radio RF PCB Boards are precision-engineered high frequency circuits manufactured to meet the demanding requirements of aerospace, defense, and telecommunications applications.
Key Parameters
- Application: Microwave radio field
- Material: Arlon TC350
- Surface finish: ENIG (Electroless Nickel Immersion Gold)
- Thickness: 0.8mm
TC350 Material Advantages
Arlon's TC350 ceramic-filled PTFE composite delivers exceptional performance in extreme environments:
- Ultra-Low Thermal Shift: εr=3.50±0.05 (-50°C to +150°C)
- Near-Zero Loss: tan δ=0.0025 @ 10GHz (50% lower than FR-4)
- Moisture Resistance: <0.02% water absorption
- CTE Matching: 17 ppm/°C (Z-axis) prevents via fracturing
Ideal Applications
- 24-77GHz Automotive Radar Arrays
- Ka-Band Satellite Transceivers
- Military Jammer Systems
- 5G mm Wave Backhaul Radios
Manufacturing Excellence
Material Processing
- Dedicated TC350 handling protocols (ESD/MSL-1 controls)
- Vacuum lamination for void-free layer bonding
- Plasma surface treatment for perfect copper adhesion
Precision Fabrication
- Laser Direct Imaging (LDI)
- 20μm AOI alignment systems
- TDR-controlled impedance testing
Quality Assurance
- 100% Time Domain Reflectometry (TDR)
- PIM Testing: -165dBc @ 2x43dBm
- Thermal Cycling: 500 cycles (-55°C ↔ +150°C)
- HAST Testing: 96hrs @ 130°C/85% RH
End-to-End Solutions
- Design Optimization - Free Stackup Simulations (HFSS/CST), Critical Resonance Analysis, Thermal Management Planning
- Prototyping Excellence - 10-Day Functional Prototypes, Material Certification Included, S-Parameter Reports to 50GHz
- Certified Production - ITAR-Registered Facility, AS9100D / NADCAP AC7120, IPC-6012 Class 3A Compliance
- Secure Supply Chain - Authorized Arlon Distributor, Full UL Traceability, NDAA-Compliant Materials
"Their TC350 phase array boards achieved ±0.3° phase consistency across 38GHz channels - outperforming US-made alternatives by 22% while reducing lead times by 5 weeks."
- Chief RF Engineer, Top-5 Defense Contractor
Competitive Advantages
- 40% Cost Savings vs. North American fabs
- Military-Grade Reliability: 0 PPM field failure rate
- Speed-to-Market: 25-day full turnkey production
- IP Protection: AES-256 encrypted data transfer
TC350 Engineering Kit Includes
- Material Dk/Df Test Coupons
- Impedance Calculator
- 24/48-Layer Stackup Templates
- DFM Checklist for High-Yield Production
İlgili Vakalar
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