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Vurgulamak
OSP Dual Sided PCB
,White Silkscreen Dual Sided PCB
,OSP fast turn pcb assembly
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MalzemeFR-4
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Silk ekranlı renkBeyaz
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Bakır ağırlığı1 oz
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Yüzey BittiOSP Daldırma Altın .lf-hasl
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Empedans kontrolüHAYIR
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Açık renkliIşıksız
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Kurşun zamanı5-7 iş günü
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TestEvrensel Elektrik Testi
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Place of OriginShenzhen,China
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Marka adıONESEINE
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SertifikaISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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FiyatUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T, Western Union
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Supply Ability1000000000pcs/mon
Dual Sided PCB Board FR-4 White Silkscreen 1oz Copper
OSP Fast Turn Dual Sided PCB Printed Circuit Board Assembly White Silkscreen
Product Specifications
| Attribute | Value |
|---|---|
| Material | FR-4 |
| Silkscreen Color | White |
| Copper Weight | 1oz |
| Surface Finished | OSP Immersion gold .LF-HASL |
| Impedance Control | No |
| Light Color | without light |
| Lead Time | 5-7 working days |
| Test | Universal Electric Testing |
Product Details
DIY Long Double Sided PCB Two Layer Copper Clad Printed Circuit Boards
PCB Specifications
- Layer: 2 layer
- Size: 300*40MM
- Surface finish: immersion gold
- Thickness: 0.8mm
- Copper weight: 1OZ outer
- Color: Yellow solder mask
Common Applications
- Consumer Electronics: Smartphones, tablets, digital cameras, TVs, and audio equipment
- Industrial Control Systems: Automation equipment, robotics, and process control systems
- Automotive Electronics: ECUs, dashboard systems, infotainment systems
- Medical Devices: Patient monitoring systems, diagnostic equipment
- Telecommunications: Routers, switches, network cards, base stations
- Industrial Electronics: Power supplies, control panels, test instruments
- LED Lighting: Efficient energy conversion and thermal management
Design Considerations
- Component Placement: Minimize signal interference and ensure proper clearance
- Signal Routing: Careful planning to avoid crosstalk and maintain integrity
- Power and Ground Planes: Reduce noise and improve signal integrity
- Thermal Management: Heat sinks, thermal vias, and copper pours for heat dissipation
- Design for Manufacturability: Proper pad sizes, solder mask openings, and trace spacing
- Testing and Debugging: Accessible test points for troubleshooting
- EMI Mitigation: Proper grounding and shielding techniques
Key Features and Advantages
- Increased circuit density for complex designs
- Enhanced functionality with through-hole and surface-mount components
- Improved signal integrity with ground/power planes
- Greater design flexibility with components on both sides
- Cost-effective compared to multi-layer PCBs
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