HDI Prototype Quick Turn Flex Circuits PCB Board Buried Blind Hole
Product Specifications
Attribute |
Value |
Solder Mask Color |
Green, Red, Blue, Black, White, Yellow |
Marketing Method |
Factory direct sales |
Product Description |
Flexible PCB 4 Layer |
Layer Count |
2 |
Surface Finishing |
ENIG |
Product |
Flexible PCB |
PCB Parameters
- Number of layers: 8
- Brand: Oneseine
- Material: Polymide
- Plate thickness: 0.13mm
- Minimum aperture: 0.2
- Minimum line width/line spacing: 0.1mm
- Copper thickness: 1OZ
- Surface technology: ENIG
- Solder resistance: Green for rigid part, yellow for flex part
Flexible PCB Technology
Flexible printed circuit boards (FPC) are made with flexible insulating substrates, offering advantages that rigid PCBs cannot match. They can bend, wind, fold, and be arranged in any spatial configuration, enabling three-dimensional movement and stretching for integrated component assembly and wire connections.
Key Advantages of FPCs
- Reduces electronic product volume significantly
- Ideal for high-density, compact, and highly reliable applications
- Widely used in aerospace, military, mobile communications, laptops, and digital cameras
- Can replace multiple rigid boards and connectors
- Single-sided circuits are perfect for dynamic or high-flex applications
Polyimide Material Benefits
- Superior Flexibility: Withstands repeated bending without cracking
- Thermal Stability: Operates up to 260°C, suitable for soldering
- Electrical Properties: Low dielectric constant maintains signal integrity
- Chemical Resistance: Resists moisture, UV, and harsh environments
- Dimensional Stability: Low thermal expansion minimizes distortion
Manufacturing Process Overview
Flex PCB manufacturing involves specialized photolithographic technology with precise control at each stage:
- Design preparation with specific flex PCB considerations
- Photolithography and etching with dimensional accuracy challenges
- Plating and surface finishing processes
- Multilayer construction with precise alignment
- Precision cutting and shaping techniques
- Component assembly and electrical testing
Flex PCB Industry Keywords
- Bend radius
- Flexural fatigue
- Polyimide (PI)
- Dielectric constant
- Glass transition temperature (Tg)
- Photolithography
- Trace/space requirements
- Wearable electronics
- IPC-2223
- Flexural testing
- Prototyping
- Volume production
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