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Vurgulamak
ENIG pcba circuit board
,Polyimide PI pcba circuit board
,ENIG multilayer flex pcb
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Ürün türüÇok katmanlı PCB, Rijit Flex PCB, FPC
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Katmanlar6
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Yüzey kaplamasıEnig, osp
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MalzemePi
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YüzeyHasl lf/enig/osp
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Empedans kontrolüEvet
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OEM hizmetiEvet
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Lehim maskesi coloYeşil, siyah, beyaz, mavi, sarı, kırmızı
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Place of OriginShenzhen,China
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Marka adıONESEINE
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SertifikaISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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FiyatUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T, Western Union
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Supply Ability1000000000pcs/mon
6 Layer Rigid Flex PCB with ENIG Surface Finish
Multilayer HDI Rigid Flex PCBA Circuit Board Polyimide PI FPC ENIG Custom
Product Specifications
| Attribute | Value |
|---|---|
| Product Type | Multilayer PCB, Rigid-Flex PCB, FPC |
| Layers | 6 |
| Surface Finish | ENIG, OSP |
| Material | PI |
| Surface | HASL Lf/Enig/OSP |
| Impedance Control | Yes |
| OEM Service | Yes |
| Solder Mask Color | Green, black, white, blue, yellow, red |
Product Overview
HDI Rigid Flex PCB 6 Layer PI FPC with ENIG Surface Manufacturing Process
Quick Details
- Flex Material: Polyimide PI
- Rigid Material: FR4
- Surface finish: Immersion gold
- Thickness: 0.2MM
- Copper weight: 0.5OZ
- Delivery time: 3-5 days for sample order, 7-9 days for mass production
- Layer: 2
- Product type: Rigid-flexible PCB
- Package: Inner: vacuum-packed bubble bag, outer: carton box
Rigid-Flexible PCB Technology
Rigid-flex PCBs combine flexible circuit boards and rigid circuit boards through stacking and specialized processes, creating a circuit board with both FPC and PCB characteristics. This hybrid construction requires both FPC and PCB production equipment.
Flexible Circuit Materials
The base material is a flexible polymer film that provides the foundation for the laminate. Polyimide films are most prevalent due to their excellent electrical, mechanical, chemical and thermal properties. Available thicknesses range from 12µm to 125µm, with thinner materials offering greater flexibility.
Technical Capabilities
| Item | Technical Parameters |
|---|---|
| Layers | 1-6 |
| Min. line width | 2/2mil |
| Min. line space | 2/2mil |
| Min. hole size | Drill hole 0.1mm; Punch hole 0.4mm |
| Max. aspect ratio | 7:1 |
| Max. board size | 500*600mm |
| Line width tolerance | ±0.015mm |
| Hole size tolerance | ±0.05mm |
| Outline tolerance | ±0.05-0.2mm |
| Base material thickness | Polyimide resin (12.5um to 125um); Polyester (50um to 100um) |
| Copper thickness | 12um to 105um |
Rigid-Flex Circuit Applications
- Mobile phones (keyboard, side buttons)
- Computers (LCD screen connections)
- CD Walkman drives
- Notebook computers
- Aerospace electronics
- Wearable devices
Product Advantages
- Space-saving design eliminates connectors and cables
- Enhanced reliability with fewer interconnects
- Superior resistance to vibration and thermal stress
- Optimized signal routing for improved integrity
- Design flexibility for complex geometries
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